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Hydroxyapatite dissolution rates in fluoride/dodecylamine solutions

dc.contributor.authorCho, P. W.en_US
dc.contributor.authorFox, Jeffrey L.en_US
dc.contributor.authorPithayanukul, P.en_US
dc.contributor.authorHiguchi, William I.en_US
dc.date.accessioned2006-04-07T18:28:30Z
dc.date.available2006-04-07T18:28:30Z
dc.date.issued1984-05en_US
dc.identifier.citationCho, P. W., Fox, J. L., Pithayanukul, P., Higuchi, W. I. (1984/05)."Hydroxyapatite dissolution rates in fluoride/dodecylamine solutions." Journal of Colloid and Interface Science 99(1): 235-243. <http://hdl.handle.net/2027.42/24831>en_US
dc.identifier.urihttp://www.sciencedirect.com/science/article/B6WHR-4CV7YFV-3C/2/7cca9ab2cb5c0bcdba0a0b4bbe5619f5en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/24831
dc.description.abstractThe influence of fluoride (F) alone and together with dodecylamine hydrochloride (DAC) on the dissolution rate behavior of hydroxyapatite (HAP) crystal suspensions has been studied. The results showed that F and DAC inhibit the dissolution in an additive rather than a synergistic manner. The data suggest that DAC inhibits dissolution from the predominant surface(s) by adsorption physically blocking the HAP surface while F inhibits the same surface by influencing the apparent driving force for dissolution. The existence of a residual component for the dissolution rate at high concentrations that is about 15% of the maximum rate suggests that there are two or more dissolution sites on the HAP crystal. The one associated with the predominant surface(s) is strongly inhibited by both F and DAC whereas the other site(s) is insensitive to F either intrinsically or, in the presence of DAC, because of possible antagonism.en_US
dc.format.extent538713 bytes
dc.format.extent3118 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.language.isoen_US
dc.publisherElsevieren_US
dc.titleHydroxyapatite dissolution rates in fluoride/dodecylamine solutionsen_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelMaterials Science and Engineeringen_US
dc.subject.hlbsecondlevelChemistryen_US
dc.subject.hlbsecondlevelChemical Engineeringen_US
dc.subject.hlbtoplevelScienceen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumCollege of Pharmacy, The University of Utah, Salt Lake City, Utah, USA; College of Pharmacy, The University of Michigan, Ann Arbor, Michigan, USA.en_US
dc.contributor.affiliationumCollege of Pharmacy, The University of Utah, Salt Lake City, Utah, USA; College of Pharmacy, The University of Michigan, Ann Arbor, Michigan, USA.en_US
dc.contributor.affiliationumCollege of Pharmacy, The University of Utah, Salt Lake City, Utah, USA; College of Pharmacy, The University of Michigan, Ann Arbor, Michigan, USA.en_US
dc.contributor.affiliationumCollege of Pharmacy, The University of Utah, Salt Lake City, Utah, USA; College of Pharmacy, The University of Michigan, Ann Arbor, Michigan, USA.en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/24831/1/0000257.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1016/0021-9797(84)90105-Xen_US
dc.identifier.sourceJournal of Colloid and Interface Scienceen_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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