A micromachined 2D positioner with electrothermal actuation and sub-nanometer capacitive sensing
dc.contributor.author | Chu, Larry L. | en_US |
dc.contributor.author | Gianchandani, Yogesh B. | en_US |
dc.date.accessioned | 2006-12-19T19:09:28Z | |
dc.date.available | 2006-12-19T19:09:28Z | |
dc.date.issued | 2003-03-01 | en_US |
dc.identifier.citation | Chu, Larry L; Gianchandani, Yogesh B (2003). "A micromachined 2D positioner with electrothermal actuation and sub-nanometer capacitive sensing." Journal of Micromechanics and Microengineering. 13(2): 279-285. <http://hdl.handle.net/2027.42/49040> | en_US |
dc.identifier.issn | 0960-1317 | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/49040 | |
dc.description.abstract | This paper reports on a multi-purpose two-axis micropositioner with sub-nanometer position sensing for precise feedback control. Along each axis it has an electrothermal actuator, a capacitive position sensor and a displacement amplifier that provides a gain of 3.37 for the sensor. It is fabricated from custom SOI wafers using dry etching, and each component is electrically and thermally isolated by silicon nitride. For a fabricated device of 65 μm thickness, the measured displacement sensitivity is 0.333 fF nm−1, which corresponds to 0.3 nm resolution with available laboratory instrumentation. The range is ≈19 μm along each axis for the positioner, which corresponds to 66 μm travel in the sense combs. Using an external parallel inductor, a positioning displacement of 9.6 μm offers a shift of 240 kHz in L–C resonance, corresponding to a sensitivity of 25 Hz nm−1. | en_US |
dc.format.extent | 3118 bytes | |
dc.format.extent | 398972 bytes | |
dc.format.mimetype | text/plain | |
dc.format.mimetype | application/pdf | |
dc.language.iso | en_US | |
dc.publisher | IOP Publishing Ltd | en_US |
dc.title | A micromachined 2D positioner with electrothermal actuation and sub-nanometer capacitive sensing | en_US |
dc.type | Article | en_US |
dc.subject.hlbsecondlevel | Physics | en_US |
dc.subject.hlbtoplevel | Science | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | Department of Electrical and Computer Engineering, University of Wisconsin, Madison, WI, USA; EECS Department, University of Michigan, Ann Arbor, MI, USA | en_US |
dc.contributor.affiliationother | Department of Electrical and Computer Engineering, University of Wisconsin, Madison, WI, USA | en_US |
dc.contributor.affiliationumcampus | Ann Arbor | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/49040/2/jm3216.pdf | en_US |
dc.identifier.doi | http://dx.doi.org/10.1088/0960-1317/13/2/316 | en_US |
dc.identifier.source | Journal of Micromechanics and Microengineering. | en_US |
dc.owningcollname | Interdisciplinary and Peer-Reviewed |
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