Design and testing of conductive polysilicon beam leads for use in a high-density biomedical connector
dc.contributor.author | Nikles, Stefan | en_US |
dc.contributor.author | Bradley, Robert M. | en_US |
dc.contributor.author | Bledsoe, Sanford C., Jr. | en_US |
dc.contributor.author | Najafi, Khalil | en_US |
dc.date.accessioned | 2006-12-19T19:09:59Z | |
dc.date.available | 2006-12-19T19:09:59Z | |
dc.date.issued | 2004-07-01 | en_US |
dc.identifier.citation | Nikles, Stefan; Bradley, Robert; Bledsoe, Sanford; Najafi, Khalil (2004). "Design and testing of conductive polysilicon beam leads for use in a high-density biomedical connector." Journal of Micromechanics and Microengineering. 14(7): 957-968. <http://hdl.handle.net/2027.42/49046> | en_US |
dc.identifier.issn | 0960-1317 | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/49046 | |
dc.description.abstract | A study was conducted to measure and characterize the reliability of polysilicon cantilever beams with electroplated gold pads for use in a high-density biomedical connector. In this design, an array of beams is brought into contact with a corresponding array of 30 µm high gold bumps, forming electrical connection. Analytical computations of multi-layer beams were performed, including the effects of residual stresses. Beam leads of various lengths and widths with electroplated gold contact pads on their ends were tested over 1000 cycles to determine their mechanical reliability, and to measure their contact resistance with gold bumps on a separate substrate. The dimensions of the polysilicon beam that produce the least breakage were determined to be 400 µm long by 125 µm wide. For a beam having a calculated contact force of ∼100 µN, the initial contact resistance was 764 mΩ. After 1000 connect/disconnect cycles, beams of this type had an average final contact resistance of 1.598 Ω. These results demonstrate that very high-density connectors with high mechanical reliability and low-contact resistance can be fabricated. | en_US |
dc.format.extent | 3118 bytes | |
dc.format.extent | 1666730 bytes | |
dc.format.mimetype | text/plain | |
dc.format.mimetype | application/pdf | |
dc.language.iso | en_US | |
dc.publisher | IOP Publishing Ltd | en_US |
dc.title | Design and testing of conductive polysilicon beam leads for use in a high-density biomedical connector | en_US |
dc.type | Article | en_US |
dc.subject.hlbsecondlevel | Physics | en_US |
dc.subject.hlbtoplevel | Science | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | Center for Wireless Integrated Microsystems, University of Michigan, 2609 Draper Road, Ann Arbor, 48109 MI, USA; Department of Biomedical Engineering, University of Michigan, 2200 Bonisteel Blvd., Ann Arbor, 48109 MI, USA | en_US |
dc.contributor.affiliationum | Department of Biological & Materials Sciences, School of Dentistry, University of Michigan, 1011 N. University, Ann Arbor, 48109 MI, USA | en_US |
dc.contributor.affiliationum | Department of Otolaryngology, University of Michigan, 1500 E. Medical Center Drive, Ann Arbor, 48109 MI, USA | en_US |
dc.contributor.affiliationum | Center for Wireless Integrated Microsystems, University of Michigan, 2609 Draper Road, Ann Arbor, 48109 MI, USA; Department of Biomedical Engineering, University of Michigan, 2200 Bonisteel Blvd., Ann Arbor, 48109 MI, USA | en_US |
dc.contributor.affiliationumcampus | Ann Arbor | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/49046/2/jmm4_7_017.pdf | en_US |
dc.identifier.doi | http://dx.doi.org/10.1088/0960-1317/14/7/017 | en_US |
dc.identifier.source | Journal of Micromechanics and Microengineering. | en_US |
dc.owningcollname | Interdisciplinary and Peer-Reviewed |
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