High-Speed Roll-to-Roll Nanoimprint Lithography on Flexible Plastic Substrates    This research is supported by NSF (grant No. CMII 0700718), AFOSR (grant No. F064-006-0084), and the University of Michigan Technology Transfer Office (GAP fund). We thank Dr. Jin-Sung Kim for providing the short-period Si mold used in this study.

Ahn, Se Hyun; Guo, L. Jay

High-Speed Roll-to-Roll Nanoimprint Lithography on Flexible Plastic Substrates This research is supported by NSF (grant No. CMII 0700718), AFOSR (grant No. F064-006-0084), and the University of Michigan Technology Transfer Office (GAP fund). We thank Dr. Jin-Sung Kim for providing the short-period Si mold used in this study.

dc.contributor.author	Ahn, Se Hyun	en_US
dc.contributor.author	Guo, L. Jay	en_US
dc.date.accessioned	2008-07-01T14:09:03Z
dc.date.available	2009-07-06T16:34:52Z	en_US
dc.date.issued	2008-06-04	en_US
dc.identifier.citation	Ahn, Se Hyun; Guo, L. Jay (2008). "High-Speed Roll-to-Roll Nanoimprint Lithography on Flexible Plastic Substrates This research is supported by NSF (grant No. CMII 0700718), AFOSR (grant No. F064-006-0084), and the University of Michigan Technology Transfer Office (GAP fund). We thank Dr. Jin-Sung Kim for providing the short-period Si mold used in this study. ." Advanced Materials 20(11): 2044-2049. <http://hdl.handle.net/2027.42/60224>	en_US
dc.identifier.issn	0935-9648	en_US
dc.identifier.issn	1521-4095	en_US
dc.identifier.uri	https://hdl.handle.net/2027.42/60224
dc.description.abstract	No Abstract.	en_US
dc.format.extent	357540 bytes
dc.format.extent	3118 bytes
dc.format.mimetype	application/pdf
dc.format.mimetype	text/plain
dc.publisher	WILEY-VCH Verlag	en_US
dc.subject.other	Chemistry	en_US
dc.subject.other	Polymer and Materials Science	en_US
dc.title	High-Speed Roll-to-Roll Nanoimprint Lithography on Flexible Plastic Substrates This research is supported by NSF (grant No. CMII 0700718), AFOSR (grant No. F064-006-0084), and the University of Michigan Technology Transfer Office (GAP fund). We thank Dr. Jin-Sung Kim for providing the short-period Si mold used in this study.	en_US
dc.type	Article	en_US
dc.rights.robots	IndexNoFollow	en_US
dc.subject.hlbsecondlevel	Engineering (General)	en_US
dc.subject.hlbsecondlevel	Materials Science and Engineering	en_US
dc.subject.hlbtoplevel	Engineering	en_US
dc.description.peerreviewed	Peer Reviewed	en_US
dc.contributor.affiliationum	Department of Mechanical Engineering University of Michigan Ann Arbor, MI 48109 (USA)	en_US
dc.contributor.affiliationum	Department of Electrical Engineering and Computer Science University of Michigan Ann Arbor, MI 48109 (USA) ; Department of Electrical Engineering and Computer Science University of Michigan Ann Arbor, MI 48109 (USA).	en_US
dc.description.bitstreamurl	http://deepblue.lib.umich.edu/bitstream/2027.42/60224/1/2044_ftp.pdf
dc.identifier.doi	http://dx.doi.org/10.1002/adma.200702650	en_US
dc.identifier.source	Advanced Materials	en_US
dc.owningcollname	Interdisciplinary and Peer-Reviewed

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