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Enhanced annealing kinetics in ion‐implanted InxAl1−xAs studied by x‐ray diffractometry

dc.contributor.authorClarke, Royen_US
dc.contributor.authorDos Passos, Waldemaren_US
dc.contributor.authorChan, Yi‐jenen_US
dc.contributor.authorPavlidis, Dimitrisen_US
dc.date.accessioned2010-05-06T22:54:28Z
dc.date.available2010-05-06T22:54:28Z
dc.date.issued1991-05-20en_US
dc.identifier.citationClarke, Roy; Dos Passos, Waldemar; Chan, Yi‐Jen; Pavlidis, Dimitris (1991). "Enhanced annealing kinetics in ion‐implanted InxAl1−xAs studied by x‐ray diffractometry." Applied Physics Letters 58(20): 2267-2269. <http://hdl.handle.net/2027.42/70911>en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/70911
dc.description.abstractWe report a rapid thermal annealing (RTA) enhancement of the structural coherence of Si‐implanted InxAl1−xAs (x≊0.54) layers on (100)InP. Under these annealing conditions (750 °C for 30 s), the enhancement occurs only in implanted samples and is characterized by the appearance of pendellösung fringes in double‐crystal x‐ray diffraction. Measurements of the parallel (ϵ∥) and perpendicular (ϵ⊥) lattice mismatch show a slight relaxation in ϵ⊥ during RTA without significant generation of dislocations (ϵ∥=0). The results suggest an electronic mechanism for the increased efficiency of RTA in implanted samples.en_US
dc.format.extent3102 bytes
dc.format.extent352267 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.publisherThe American Institute of Physicsen_US
dc.rights© The American Institute of Physicsen_US
dc.titleEnhanced annealing kinetics in ion‐implanted InxAl1−xAs studied by x‐ray diffractometryen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumCenter for High Frequency Microelectronics, Department of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, Michigan 48109‐2122en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/70911/2/APPLAB-58-20-2267-1.pdf
dc.identifier.doi10.1063/1.104895en_US
dc.identifier.sourceApplied Physics Lettersen_US
dc.identifier.citedreferenceG. Ng, D. Pavlidis, M. Jaffe, J. Singh, and H-F. Chau, IEEE Trans. Electron. Device 36, 2249 (1989).en_US
dc.identifier.citedreferenceM. D. Feuer, D. M. Tennent, J. M. Kuo, S. C. Shank, B. Tell, and T. Y. Chang, IEEE Electron. Device Lett. 10, 70 (1989).en_US
dc.identifier.citedreferenceA. I. Akinwande, IEEE IEDM Tech. Dig. 97 (1989).en_US
dc.identifier.citedreferenceP. Pearah, T. Henderson, J. Kletn, H. Morkoc, B. Nilsson, O. Wu, A. W. Swanson, and D. R. Chen, J. Appl. Phys. 56, 1851 (1984).en_US
dc.identifier.citedreferenceM. H. Lyons and M. A. G. Halliwell, Inst. Phys. Conf. Ser. 76, 445 (1985).en_US
dc.identifier.citedreferenceThe InxAl1−xAsInxAl1−xAs layer was lightly doped with Si during growth. This bulk doping ( ≈ 5×l017 cm−3≈5×l017cm−3) is approximately 150 of the ion-implanted dopant density.en_US
dc.identifier.citedreferenceM. J. Hill and B. K. Tanner, J. Appl. Cryst. 18, 446 (1985).en_US
dc.identifier.citedreferenceL. Tapfer and K. Ploog, Phys. Rev. B 33, 5565 (1986).en_US
dc.identifier.citedreferenceB. M. Paine, N. N. Hurvitz, and V. S. Speriosu, J. Appl. Phys. 61, 1335 (1987).en_US
dc.identifier.citedreferenceJ. Hornstra and W. J. Bartels, J. Cryst. Growth 44, 513 (1978).en_US
dc.identifier.citedreferenceK. H. Chang, P. R. Berger, R. Gibala, P. K. Bhattacharya, J. Singh, J. F. Mansfield, and R. Clarke, in Dislocations and Interfaces in Semiconductors, edited by K. Rajan, J. Narayan, and D. Ast (Metallurgical Society, Warrendale, PA, 1988), p. 157.en_US
dc.identifier.citedreferenceJ. Singh and K. K. Bajaj, J. Vac. Sci. Technol. A 6, 2022 (1988).en_US
dc.identifier.citedreferenceJ. M. Bonar, R. Hull, R. J. Malik, R. W. Ryan, and J. F. Walker, Proc. Mater. Res. Soc. 160, 117 (1990).en_US
dc.identifier.citedreferenceW. O. Adekoya, M. Hage-Ali, J. C. Muller, and P. Siffert, J. Appl. Phys. 64, 666 (1988).en_US
dc.owningcollnamePhysics, Department of


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