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Stacked Packaging Laminar-Convection-Cooled Printed Circuit Using the Entropy Generation Minimization Method

dc.contributor.authorTorii, Shuichien_US
dc.contributor.authorFurukawa, Takahiroen_US
dc.contributor.authorYang, Wen-Jeien_US
dc.date.accessioned2010-06-11T18:25:02Z
dc.date.available2010-06-11T18:25:02Z
dc.date.issued2008en_US
dc.identifier.citationTorii, Shuichi; Furukawa, Takahiro; Yang, Wen-Jei (2008). "Stacked Packaging Laminar-Convection-Cooled Printed Circuit Using the Entropy Generation Minimization Method" Journal of Thermophysics and Heat Transfer, vol.22 no.2 (315-318). <http://hdl.handle.net/2027.42/76567>en_US
dc.identifier.issn0887-8722en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/76567
dc.format.extent514845 bytes
dc.format.extent3112 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.publisherAmerican Institute of Aeronautics and Astronauticsen_US
dc.titleStacked Packaging Laminar-Convection-Cooled Printed Circuit Using the Entropy Generation Minimization Methoden_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelAerospace Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumUniversity of Michiganen_US
dc.contributor.affiliationotherKumamoto Univeristyen_US
dc.contributor.affiliationotherCorning companyen_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/76567/1/AIAA-30451-562.pdf
dc.identifier.doi10.2514/1.30451en_US
dc.identifier.sourceJournal of Thermophysics and Heat Transferen_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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