Organic light emitting devices with enhanced outcoupling via microlenses fabricated by imprint lithography
dc.contributor.author | Sun, Yiru | en_US |
dc.contributor.author | Forrest, Stephen R. | en_US |
dc.date.accessioned | 2011-11-15T16:07:46Z | |
dc.date.available | 2011-11-15T16:07:46Z | |
dc.date.issued | 2006-10-01 | en_US |
dc.identifier.citation | Sun, Yiru; Forrest, Stephen R. (2006). "Organic light emitting devices with enhanced outcoupling via microlenses fabricated by imprint lithography." Journal of Applied Physics 100(7): 073106-073106-6. <http://hdl.handle.net/2027.42/87744> | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/87744 | |
dc.description.abstract | High efficiency white organic light emitting devices (WOLEDs) with optical outcoupling enhanced by hexagonal polymethylmethacrylate microlens arrays fabricated by imprint lithography on a glass substrate are demonstrated. Monte Carlo and finite difference time domain simulations of the emitted light are used to optimize the microlens design. The measured enhancement of light outcoupling and the angular dependence of the extracted light intensity are in agreement with the simulation. Using microlens arrays, we demonstrate a fluorescent/phosphorescent WOLED with a maximum external quantum efficiency of (14.3±0.3)%(14.3±0.3)% at 900 cd/m2900cd∕m2 and power efficiency of 21.6±0.5 lm/W21.6±0.5lm∕W at 220 cd/m2220cd∕m2. The electroluminescent spectra at viewing angles from normal to the substrate plane, to 60° off normal, remain almost unchanged, giving a color rendering index of 87. | en_US |
dc.publisher | The American Institute of Physics | en_US |
dc.rights | © The American Institute of Physics | en_US |
dc.title | Organic light emitting devices with enhanced outcoupling via microlenses fabricated by imprint lithography | en_US |
dc.type | Article | en_US |
dc.subject.hlbsecondlevel | Physics | en_US |
dc.subject.hlbtoplevel | Science | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan 48109; Department of Applied Physics, University of Michigan, Ann Arbor, Michigan 48109; and Department of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109 | en_US |
dc.contributor.affiliationother | Princeton Institute for the Science and Technology of Materials (PRISM), Princeton University, Princeton, New Jersey 08544 and Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544 | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/87744/2/073106_1.pdf | |
dc.identifier.doi | 10.1063/1.2356904 | en_US |
dc.identifier.source | Journal of Applied Physics | en_US |
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