Full-wave characterization of high-frequency nonplanar interconnects.
dc.contributor.author | Engel, Andrew George, Jr. | en_US |
dc.contributor.advisor | Katehi, Linda P. B. | en_US |
dc.date.accessioned | 2014-02-24T16:14:41Z | |
dc.date.available | 2014-02-24T16:14:41Z | |
dc.date.issued | 1993 | en_US |
dc.identifier.other | (UMI)AAI9319520 | en_US |
dc.identifier.uri | http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:9319520 | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/103399 | |
dc.description.abstract | As monolithic and VLSI circuits are designed to perform multiple functions at heightened frequencies, increased complexity through the use of nonplanar interconnects is inevitable. These interconnects include strip-ridge structures, which consist of conducting strips suspended by dielectric ridges and/or a substrate above a ground plane in the proximity of other conductors on other ridges and localized superstrates, and monolithic dielectric waveguides, which are dielectric strips either raised above or embedded in a substrate. General methods for the analysis and design of nonplanar interconnects decrease the need for empirical characterization, resulting in substantial reductions in fabrication costs and design cycle time. A hybrid full-wave integral equation-mode matching (IEMM) technique is developed to study strip-ridge structures in the frequency and time domains, and a mode matching method is used to characterize monolithic dielectric waveguides. The IEMM technique analytically decouples a structure into two parts, namely, the conducting strips and the supporting dielectrics, and is thus capable of efficiently analyzing a class of three-dimensional structures in which the uniformity of the dielectric support structure along the longitudinal direction is preserved. Coupled microstrip on ridges, coupled microstrip with an etched groove, microstrip with finite substrate and ground plane, coupled multilevel microstrip with a finite intermediate dielectric layer, and an electro-optic modulator structure with an etched groove are characterized. The results introduce new methods for increasing packing density, decreasing crosstalk, and enhancing coupling in VLSI, monolithic and hybrid applications. Low-loss monolithic sub-millimeter-wave and terahertz dielectric waveguides are proposed and characterized. Examples for the 0.3-2.0 THz and 0.1-0.3 THz ranges demonstrate that the materials and structures available in monolithic technology allow the propagating power to be confined in a convenient region at a given frequency. A shielded transition from the waveguide to a power source is characterized from IEMM results. The presence of higher order modes due to the shielding is considered, and the electrical performance of a wide-band, efficient transition is presented. | en_US |
dc.format.extent | 180 p. | en_US |
dc.subject | Engineering, Electronics and Electrical | en_US |
dc.title | Full-wave characterization of high-frequency nonplanar interconnects. | en_US |
dc.type | Thesis | en_US |
dc.description.thesisdegreename | PhD | en_US |
dc.description.thesisdegreediscipline | Electrical Engineering | en_US |
dc.description.thesisdegreegrantor | University of Michigan, Horace H. Rackham School of Graduate Studies | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/103399/1/9319520.pdf | |
dc.description.filedescription | Description of 9319520.pdf : Restricted to UM users only. | en_US |
dc.owningcollname | Dissertations and Theses (Ph.D. and Master's) |
Files in this item
Remediation of Harmful Language
The University of Michigan Library aims to describe library materials in a way that respects the people and communities who create, use, and are represented in our collections. Report harmful or offensive language in catalog records, finding aids, or elsewhere in our collections anonymously through our metadata feedback form. More information at Remediation of Harmful Language.
Accessibility
If you are unable to use this file in its current format, please select the Contact Us link and we can modify it to make it more accessible to you.