Show simple item record

Thermoelectric Properties of Nanostructured Silicon Films.

dc.contributor.authorGuo, Xiaoen_US
dc.date.accessioned2014-06-02T18:16:16Z
dc.date.availableNO_RESTRICTIONen_US
dc.date.available2014-06-02T18:16:16Z
dc.date.issued2014en_US
dc.date.submitted2014en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/107271
dc.description.abstractBased on the Seebeck effect, thermoelectric materials can convert temperature heat into electrical energy. Alternatively, based on the Peltier effect, thermoelectric cooling can be achieved by supplying current through thermoelectric materials. Since the best thermoelectric materials are heavily doped semiconductors, and silicon is the most abundant semiconductor on earth, investigation of the thermoelectric properties of strained silicon and ~100 nm thick silicon thin films, and the thermoelectric cooling application of the ~100 nm thick silicon thin film become the focus of this dissertation. In the Seebeck effect, charge carriers thermally diffuse from a high temperature to low temperature, creating an open circuit voltage potential across the thermoelectric material. However, the application of such technology is mainly limited due to its poor efficiency when competing with the traditional engines; the efficiency depends on the temperature difference and a dimensionless figure of merit, ZT. It has been determined that ZT=S2σT/κ, in which S2σ is the power factor, S is the Seebeck coefficient, σ is the electrical conductivity, κ is the thermal conductivity, and T is the average temperature. The interdependence of S, σ and κ makes it difficult to improve ZT because optimizing one parameter adversely affects another. ZT is the key parameter to determine the thermoelectric performance not only in thermoelectric power generation application based on Seebeck effect, but also in thermoelectric cooling application based on Peltier effect. A higher ZT results in better thermoelectric performance. It has been proved that silicon nanomesh materials result in a reduced thermal conductivity due to the increased phonon-boundary scattering. This work focuses on using novel nanostructured silicon thin films fabricated by block copolymer lithography to study thermoelectric properties of silicon, and to use these results to estimate the thermoelectric performance of two types of silicon thin films with nanomesh structures.en_US
dc.language.isoen_USen_US
dc.subjectNanostructureen_US
dc.subjectThin Filmen_US
dc.subjectThermoelectricsen_US
dc.subjectSiliconen_US
dc.subjectBlock Copolymeren_US
dc.titleThermoelectric Properties of Nanostructured Silicon Films.en_US
dc.typeThesisen_US
dc.description.thesisdegreenamePhDen_US
dc.description.thesisdegreedisciplineMaterials Science and Engineeringen_US
dc.description.thesisdegreegrantorUniversity of Michigan, Horace H. Rackham School of Graduate Studiesen_US
dc.contributor.committeememberBoukai, Akramen_US
dc.contributor.committeememberSylvester, Dennis Michaelen_US
dc.contributor.committeememberTuteja, Anishen_US
dc.contributor.committeememberSangi Reddy, Pramoden_US
dc.subject.hlbsecondlevelMaterials Science and Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/107271/1/gxecho_1.pdf
dc.owningcollnameDissertations and Theses (Ph.D. and Master's)


Files in this item

Show simple item record

Remediation of Harmful Language

The University of Michigan Library aims to describe its collections in a way that respects the people and communities who create, use, and are represented in them. We encourage you to Contact Us anonymously if you encounter harmful or problematic language in catalog records or finding aids. More information about our policies and practices is available at Remediation of Harmful Language.

Accessibility

If you are unable to use this file in its current format, please select the Contact Us link and we can modify it to make it more accessible to you.