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Non‐Destructive Wafer Recycling for Low‐Cost Thin‐Film Flexible Optoelectronics
dc.contributor.authorLee, Kyusangen_US
dc.contributor.authorZimmerman, Jeramy D.en_US
dc.contributor.authorHughes, Tyler W.en_US
dc.contributor.authorForrest, Stephen R.en_US
dc.date.accessioned2014-08-06T16:49:45Z
dc.date.availableWITHHELD_12_MONTHSen_US
dc.date.available2014-08-06T16:49:45Z
dc.date.issued2014-07en_US
dc.identifier.citationLee, Kyusang; Zimmerman, Jeramy D.; Hughes, Tyler W.; Forrest, Stephen R. (2014). "Non‐Destructive Wafer Recycling for Low‐Cost Thin‐Film Flexible Optoelectronics." Advanced Functional Materials 24(27): 4284-4291.en_US
dc.identifier.issn1616-301Xen_US
dc.identifier.issn1616-3028en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/108039
dc.publisherWiley Periodicals, Inc.en_US
dc.subject.otherIII‐V Optoelectronicsen_US
dc.subject.otherWafer Reuseen_US
dc.subject.otherFlexible Thin‐Film Electronicsen_US
dc.subject.otherEpitaxial Lift‐Offen_US
dc.subject.otherCold Weld Bondingen_US
dc.titleNon‐Destructive Wafer Recycling for Low‐Cost Thin‐Film Flexible Optoelectronicsen_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelEngineering (General)en_US
dc.subject.hlbsecondlevelMaterials Science and Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/108039/1/adfm201400453.pdf
dc.identifier.doi10.1002/adfm.201400453en_US
dc.identifier.sourceAdvanced Functional Materialsen_US
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dc.owningcollnameInterdisciplinary and Peer-Reviewed


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