Economical, Isotropic Silicon Etching Machine

Abstract

The equipment used to isotropically etch silicon wafers for MEMS (Micro Electro-Mechanical Systems) applications is very expensive. Due to this, the amount of growth of this developing technology is limited to entities with large monetary resources. The goal of this project is to design an alternative piece of equipment which achieves the same results but at a more economical cost. The introduction of a less expensive alternative will expand MEMS technology to more people and in turn technology will be able to progress at a faster rate.