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6.3.1 Modular Design Approach for Development of Electrical, Electronic, and Software System Architectures for Multiple Product Platforms
dc.contributor.authorRushton, Garyen_US
dc.contributor.authorZakarian, Armenen_US
dc.contributor.authorGrigoryan, Tigranen_US
dc.date.accessioned2014-12-09T16:53:41Z
dc.date.available2014-12-09T16:53:41Z
dc.date.issued2003-07en_US
dc.identifier.citationRushton, Gary; Zakarian, Armen; Grigoryan, Tigran (2003). "6.3.1 Modular Design Approach for Development of Electrical, Electronic, and Software System Architectures for Multiple Product Platforms." INCOSE International Symposium 13(1): 517-527.en_US
dc.identifier.issn2334-5837en_US
dc.identifier.issn2334-5837en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/109591
dc.description.abstractModular systems provide the ability to achieve product variety through the combination and standardization of components. Modular design approaches used in the development of electrical, electronic, and software (EES) systems allow sharing of architectures/modules between different product lines. Modular products provide economies of scale, reduced development time, reduced order lead‐time, and easier product diagnostics, maintenance and repair. In this paper, new optimization algorithms and software tools are presented that allow EES system design engineers to develop architectures/modules that can be shared across product platforms (for OEMs) and across OEMs (for suppliers). Approaches presented in this paper use matrix clustering and graph based techniques. The application of the approach is illustrated with an example from the automotive industry on the development of a modular EES system that can be shared across multiple vehicle platforms.en_US
dc.publisherEnglewood Cliffsen_US
dc.publisherWiley Periodicals, Inc.en_US
dc.title6.3.1 Modular Design Approach for Development of Electrical, Electronic, and Software System Architectures for Multiple Product Platformsen_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelIndustrial and Operations Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/109591/1/iis202637.pdf
dc.identifier.doi10.1002/j.2334-5837.2003.tb02637.xen_US
dc.identifier.sourceINCOSE International Symposiumen_US
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dc.owningcollnameInterdisciplinary and Peer-Reviewed


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