Show simple item record

An integrated electrostatic peristaltic gas micropump with active microvalves.

dc.contributor.authorKim, Hanseup
dc.contributor.advisorNajafi, Khalil
dc.date.accessioned2016-08-30T16:07:39Z
dc.date.available2016-08-30T16:07:39Z
dc.date.issued2006
dc.identifier.urihttp://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:3224924
dc.identifier.urihttps://hdl.handle.net/2027.42/126075
dc.description.abstractA high-performance micro gas pump for high-speed micro gas chromatography (muGC) as well as several microfabrication technologies used to build the proposed micropump, are reported. A high-flow, high-pressure, low-power, and small micro gas pump is needed for sample collection and transportation in a micromachined gas chromatography. Previous micro gas pumps have suffered from low flow-rate, low pressure, large volume, and high-power dissipation. The developed micropump utilizes a number of techniques to achieve low-power electrostatic pumping in a compact module: (1) a multi-stage configuration that creates a small pressure in individual stages, and accumulates these pressures to obtain a high pressure differential across the entire pump; (2) a fluidic resonance-based operation to achieve high flow rate despite the tiny volume displacement of each pump; (3) active timing control of microvalves to regulate pump operation; and (4) several new designs including checkerboard microvalves, dual curved electrodes, and dual pumping chambers. The micropump is fabricated by using new microfabrication technologies. First, a Parylene-assisted wafer bonding technology, performed at a low-temperature of &sim;230C&deg;, constructs enclosed pumping chambers without damaging polymer structures, and provides a bond strength of 3.6MPa. Second, a wafer-level Parylene membrane transfer technique constructs pumping and valve membranes between two pumping chambers. The membranes are thin (0.8mum-thick), flexible, freestanding, and cover a shallow (&sim;5mum deep) and wide (&sim;2000mum long) recess. Third, an electrode buckling technology forms a smooth out-of-plane curved electrode using only one mask by buckling the thin films under built-in stress with a uniformity of 95% across a 100mm wafer. The fabricated 18-stage pump operates at 14 kHz and produces an air flow rate of 4.0cc/min and a pressure of 17500Pa, using a total power of &sim;57mW. It has operated over a 6-month period for a total of &sim;300 minutes and has a volume of 25.1x19.1x1mm<super>3</super>. Four- and two-stage pumps demonstrated flow rates of 3.0 and 2.1cc/min and pressures of 7000 and 2500Pa. The 4-stage pump is combined with a microcolumn and a chemiresistor to form a functioning muGC where 4 vapors are separated within 7 seconds. This is the first MEMS-GC analysis featuring an integrated micropump.
dc.format.extent294 p.
dc.languageEnglish
dc.language.isoEN
dc.subjectActive
dc.subjectElectrostatic
dc.subjectGas Micropump
dc.subjectIntegrated
dc.subjectMems
dc.subjectMicrovalves
dc.subjectPeristaltic
dc.titleAn integrated electrostatic peristaltic gas micropump with active microvalves.
dc.typeThesis
dc.description.thesisdegreenamePhDen_US
dc.description.thesisdegreedisciplineApplied Sciences
dc.description.thesisdegreedisciplineElectrical engineering
dc.description.thesisdegreegrantorUniversity of Michigan, Horace H. Rackham School of Graduate Studies
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/126075/2/3224924.pdf
dc.owningcollnameDissertations and Theses (Ph.D. and Master's)


Files in this item

Show simple item record

Remediation of Harmful Language

The University of Michigan Library aims to describe library materials in a way that respects the people and communities who create, use, and are represented in our collections. Report harmful or offensive language in catalog records, finding aids, or elsewhere in our collections anonymously through our metadata feedback form. More information at Remediation of Harmful Language.

Accessibility

If you are unable to use this file in its current format, please select the Contact Us link and we can modify it to make it more accessible to you.