Packaging Technologies for Millimeter Scale Microsystems in Harsh Environment Applications

Abstract

Microsystems capable of sensing temperature, pressure and other parameters are needed for many applications, for example, gathering information in downhole environments for oil and gas exploration. Certain target locations limit the size of the microsystems to millimeter or even sub-millimeter scale. In addition, the high temperature, high pressure, and corrosive ambient environments are challenging for microsystems. Target environments include 125°C temperature, 50 MPa pressure, and salinity standards consistent with American Petroleum Institute (API) brine (8% NaCl + 2% CaCl2). Other chemicals including hydrocarbons and cement slurry are also found in these environments. The system package plays a critical role as it protects the system components against environment, while also providing the physical coupling to the environment, e.g., for communication modules and pressure sensors. The package must be made of mechanically and chemically robust materials. High temperature assembly steps must be avoided in the packaging process (such as bonding above 200°C), because these steps are generally incompatible with embedded batteries and polymer-based sensors. The development of system package and relevant technologies is the focus of this dissertation. This dissertation first describes the design and fabrication of sapphire-on-steel packages in two sizes (0.8 mm and 8 mm), which are capable of isolating high pressure while allowing optical communication. These packages have been operated with embedded electronics at 125ºC and ≈70 MPa in API brine, hydrocarbons, and cement slurry. Additionally, polymer-in-tube packages are reported, which allow the embedded pressure sensors to couple with the environment. These packages have been successfully operated with embedded electronics and sensors at 125ºC and 50 MPa in API brine. A third approach of encapsulation that is reported involves polymer film encapsulation, which has the potential to significantly improve the chemical resistance of microsystems. Finally a batch-mode packaging process is presented based on micro-crimping, enabling room temperature assembly for sub-millimeter scale packages made by metal alloys. This packaging process has been demonstrated by a 5×5 array of 0.5 mm packages. These packages have survived at least 200 MPa pressure and at least 72 h in API brine.