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Tunable substrate with electrodes for cardiomyocyte maturation compatible with high throughput testing

dc.contributor.authorWei, Katherine
dc.contributor.authorStis, Austin
dc.contributor.authorDePalma, Samuel
dc.contributor.authorBaker, Brendon
dc.contributor.authorShtein, Max
dc.contributor.advisorShtein, Max
dc.date.accessioned2023-05-26T17:53:15Z
dc.date.available2023-05-26T17:53:15Z
dc.date.issued2022
dc.identifier.urihttps://hdl.handle.net/2027.42/176713
dc.description.abstractIn vitro induced pluripotent stem cell-derived cardiomyocytes (iPSC-CMs) can be used to test cardiotoxicity and study disease. When developing new drugs, cardiotoxicity needs to be tested. However, the immaturity of iPSC-CMs in vitro is a limitation. Studies have shown that physical and electrical stimulation aid in maturation of iPSC-CMs. Kirigami, the Japanese art of paper cutting, concepts are applied to design and create an easily manufacturable substrate. The krigami substrate in tandem with a custom well plate provide sufficient conditions for cardiomyocytes to mature while providing mechanical stimulation. Further, this design can be manufactured rapidly, allowing it to be compatible with high throughput testing.
dc.subjecttissues
dc.subjectmechanical stimulation
dc.titleTunable substrate with electrodes for cardiomyocyte maturation compatible with high throughput testing
dc.typeProject
dc.subject.hlbtoplevelEngineering
dc.description.peerreviewedNA
dc.contributor.affiliationumMaterials Science and Engineering
dc.contributor.affiliationumBiomedical Engineering
dc.contributor.affiliationumBiomedical Engineering
dc.contributor.affiliationumBiomedical Engineering
dc.contributor.affiliationumMaterials Science and Engineering
dc.contributor.affiliationumcampusAnn Arbor
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/176713/1/weik_capstone_report__-_Katie_Wei.pdf
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/176713/2/weik_expo__poster_-_Katie_Wei.pptx
dc.identifier.doihttps://dx.doi.org/10.7302/7562
dc.working.doi10.7302/7562en
dc.owningcollnameHonors Program, The College of Engineering


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