Additive Manufacturing Processes for Photonics and Electronics

Abstract

Advances in additive manufacturing have revolutionized the fabrication of functional photonic and electronic materials, offering sustainable solutions for vibrant structural color coatings and high-performance printed electronics. This thesis explores innovative strategies for integrating abundant natural minerals and advanced printing techniques to create durable, cost-effective materials for versatile applications. The fundamentals of structural color theory and their application to simple, vibrant thin-film stacks are presented, supported by simulations and interference calculations to understand the physical mechanisms of these designs. High-Low-Absorber (HLA) and Metal-Dielectric-Metal (MDM) structures are examined as foundational designs for high-chroma coatings, demonstrating the potential of interference-based methods for achieving intense, environmentally stable colors. HLA structures were developed using minimally processed minerals, such as rutile-derived TiO2 and silica-based SiO2, to produce scalable, tri-layered coatings with significant reductions in material costs and environmental impact compared to traditional pigment-based coatings. A novel metallic copper oxide absorber film was fabricated using a mixture of iron oxide and copper oxide mineral powders, showcasing a sustainable approach to color production. Additionally, this work discusses repeatability and best practices for electron-beam evaporation of mineral powders to ensure consistent coating performance. The utility of structural color coatings is extended to advanced applications, including optical sensing and decorative technologies. Thermochromic TiO2 coatings exhibit viable temperature-sensing capabilities, suitable for integrated optics circuits. Glass fusing techniques create robust structural colored glass for decorative purposes, while structural black coatings provide durable, low-reflection finishes for aesthetic and functional applications. Area-selective atomic layer deposition (AS-ALD) was used to achieve precise patterning and conformal deposition of structural colors, enabling vibrant, uniform coatings on complex 3D-printed objects. Microscale multi-color patterns were also created with AS-ALD, offering scalable, high-resolution optical designs. The integration of Spatial ALD (SALD) to enhance film uniformity and throughput is also discussed. In the realm of electronics, a novel photoacoustic printing method, Shock-wave Jet Printing (SJP), addressed limitations in traditional printing methods, such as nozzle-clogging and material degradation. SJP enabled high-resolution deposition of carbon nanotubes (CNTs) for thin-film transistors, achieving competitive effective mobilities compared to conventional inkjet printing. The effective mobility of percolating CNT networks was analyzed, providing insights into device performance. SJP was further demonstrated for solid-state printing of organic molecules, preserving material integrity while achieving high-resolution patterns critical for optoelectronics and sensing applications. Emissive organic molecules were successfully deposited in microscale patterns, showing the potential of SJP for processing materials incompatible with traditional techniques. Together, these findings establish a synergistic framework for additive manufacturing of structural colors and electronics, utilizing abundant raw materials and advanced fabrication techniques to address both aesthetic and functional demands. This work sets the stage for future studies in sustainable photonics and printed electronics, advancing the field toward scalable, cost-effective, and environmentally conscious manufacturing processes.