Process alternatives and scaling limits for high-density silicon tactile imagers
dc.contributor.author | Suzuki, K. | en_US |
dc.contributor.author | Najafi, Khalil | en_US |
dc.contributor.author | Wise, K. D. (Kensall D.) | en_US |
dc.date.accessioned | 2006-04-10T13:47:40Z | |
dc.date.available | 2006-04-10T13:47:40Z | |
dc.date.issued | 1990-04 | en_US |
dc.identifier.citation | Suzuki, K., Najafi, K., Wise, K. D. (1990/04)."Process alternatives and scaling limits for high-density silicon tactile imagers." Sensors and Actuators A: Physical 23(1-3): 915-918. <http://hdl.handle.net/2027.42/28661> | en_US |
dc.identifier.uri | http://www.sciencedirect.com/science/article/B6THG-44CJ2HG-R/2/bc8b7f29738cb0a52509436dfbf1d0ab | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/28661 | |
dc.description.abstract | In this paper the process complexities and parasitic substrate coupling effects are compared for several different high-density capacitive tactile imagers. The dissolved-wafer process using diffused bulk-silicon row lines and metal-on-glass columns is found to offer the simplest process and fastest response, requiring only five non-critical masks and producing a settling time for the column charge of about 1 [mu]s. Using this process, a 1024-element array with a force range of 1 gm and a spatial resolution of 500 [mu]m produces a force resolution equivalent to seven bits. Scaled to a 4096-element array, this same process should produce a force resolution of nearly six bits for the same force range and a spatial resolution of 250 [mu]m. | en_US |
dc.format.extent | 295207 bytes | |
dc.format.extent | 3118 bytes | |
dc.format.mimetype | application/pdf | |
dc.format.mimetype | text/plain | |
dc.language.iso | en_US | |
dc.publisher | Elsevier | en_US |
dc.title | Process alternatives and scaling limits for high-density silicon tactile imagers | en_US |
dc.type | Article | en_US |
dc.rights.robots | IndexNoFollow | en_US |
dc.subject.hlbsecondlevel | Mechanical Engineering | en_US |
dc.subject.hlbsecondlevel | Industrial and Operations Engineering | en_US |
dc.subject.hlbtoplevel | Engineering | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | Center for Integrated Sensors and Circuits, Solid-State Electronics Laboratory, The University of Michigan, Ann Arbor, MI 48109-2122 U.S.A. | en_US |
dc.contributor.affiliationum | Center for Integrated Sensors and Circuits, Solid-State Electronics Laboratory, The University of Michigan, Ann Arbor, MI 48109-2122 U.S.A. | en_US |
dc.contributor.affiliationother | Sensor Research Laboratory, Microelectronics Research Laboratories, NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229 Japan | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/28661/1/0000478.pdf | en_US |
dc.identifier.doi | http://dx.doi.org/10.1016/0924-4247(90)87059-R | en_US |
dc.identifier.source | Sensors and Actuators A: Physical | en_US |
dc.owningcollname | Interdisciplinary and Peer-Reviewed |
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