View Item 

Show simple item record

Failure analysis of solder joints with a damage-coupled viscoplastic model
dc.contributor.authorWei, Y.en_US
dc.contributor.authorChow, C. L.en_US
dc.contributor.authorNeilsen, M. K.en_US
dc.contributor.authorFang, H. E.en_US
dc.date.accessioned2006-04-19T13:38:54Z
dc.date.available2006-04-19T13:38:54Z
dc.date.issued2003-04-14en_US
dc.identifier.citationWei, Y.; Chow, C. L.; Neilsen, M. K.; Fang, H. E. (2003)."Failure analysis of solder joints with a damage-coupled viscoplastic model." International Journal for Numerical Methods in Engineering 56(14): 2199-2211. <http://hdl.handle.net/2027.42/34537>en_US
dc.identifier.issn0029-5981en_US
dc.identifier.issn1097-0207en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/34537
dc.description.abstractThis paper presents failure analysis of solder joints with a damage-coupled viscoplastic model. A material model is developed to characterize the elasticity, plasticity, creep and damage of solder. A semi-implicit time-integration approach is adopted for the numerical implementation of the solder model. This solder model has been implemented into finite element codes developed at Sandia National Laboratories and into the commercial, finite element code ABAQUS TM with its user-defined material subroutine UMAT. Finite element analyses are performed on solder joints with the new solder constitutive model and mesh dependency of these analyses is investigated. Copyright © 2003 John Wiley & Sons, Ltd.en_US
dc.format.extent164893 bytes
dc.format.extent3118 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.language.isoen_US
dc.publisherJohn Wiley & Sons, Ltd.en_US
dc.subject.otherEngineeringen_US
dc.subject.otherNumerical Methods and Modelingen_US
dc.titleFailure analysis of solder joints with a damage-coupled viscoplastic modelen_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelEngineering (General)en_US
dc.subject.hlbsecondlevelMechanical Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Mechanical Engineering, University of Michigan-Dearborn, Dearborn, MI 48128, U.S.A.en_US
dc.contributor.affiliationumDepartment of Mechanical Engineering, University of Michigan-Dearborn, Dearborn, MI 48128, U.S.A. ; Department of Mechanical Engineering, University of Michigan-Dearborn, 4901 Evergreen Road, Dearborn, MI 48128, U.S.A.en_US
dc.contributor.affiliationotherSandia National Laboratories, Albuquerque, NM 87185, U.S.A.en_US
dc.contributor.affiliationotherSandia National Laboratories, Albuquerque, NM 87185, U.S.A.en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/34537/1/660_ftp.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1002/nme.660en_US
dc.identifier.sourceInternational Journal for Numerical Methods in Engineeringen_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


Files in this item

Name:
660_ftp.pdf
Size:
161.0KB
Format:
PDF
View/Open

Show simple item record

Remediation of Harmful Language

The University of Michigan Library aims to describe library materials in a way that respects the people and communities who create, use, and are represented in our collections. Report harmful or offensive language in catalog records, finding aids, or elsewhere in our collections anonymously through our metadata feedback form. More information at Remediation of Harmful Language.

Accessibility

If you are unable to use this file in its current format, please select the Contact Us link and we can modify it to make it more accessible to you.