A quantitative adhesion test for thin polymer films on silicon substrates
dc.contributor.author | Goldberg, Howard D. | en_US |
dc.contributor.author | Cha, Geun Sig | en_US |
dc.contributor.author | Brown, Richard B. | en_US |
dc.date.accessioned | 2006-04-28T18:06:59Z | |
dc.date.available | 2006-04-28T18:06:59Z | |
dc.date.issued | 1991-10-05 | en_US |
dc.identifier.citation | Goldberg, H. D.; Cha, G. S.; Brown, R. B. (1991)."A quantitative adhesion test for thin polymer films on silicon substrates." Journal of Applied Polymer Science 43(7): 1287-1292. <http://hdl.handle.net/2027.42/38611> | en_US |
dc.identifier.issn | 0021-8995 | en_US |
dc.identifier.issn | 1097-4628 | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/38611 | |
dc.description.abstract | The standard 90° peel test was modified in order to apply it to testing adhesion of thin polymer films to surfaces of silicon substrates, such as the silicon nitride passivation layer used in our solid-state chemical sensors. The goal of this task was to develop a procedure for testing adhesion of both dry and wet films, which would yield repeatable, quantitative results quickly, and with simple sample preparation. It is important to produce valid comparisons of adhesion both over variations of a given polymer composition, and between films made of dissimilar polymer matrices. The method described herein could be applied to adhesion testing of a wide variety of thin polymer layers to solid surfaces. | en_US |
dc.format.extent | 504811 bytes | |
dc.format.extent | 3118 bytes | |
dc.format.mimetype | application/pdf | |
dc.format.mimetype | text/plain | |
dc.language.iso | en_US | |
dc.publisher | Wiley Subscription Services, Inc., A Wiley Company | en_US |
dc.subject.other | Chemistry | en_US |
dc.subject.other | Polymer and Materials Science | en_US |
dc.title | A quantitative adhesion test for thin polymer films on silicon substrates | en_US |
dc.type | Article | en_US |
dc.rights.robots | IndexNoFollow | en_US |
dc.subject.hlbsecondlevel | Chemical Engineering | en_US |
dc.subject.hlbsecondlevel | Chemistry | en_US |
dc.subject.hlbsecondlevel | Management | en_US |
dc.subject.hlbsecondlevel | Economics | en_US |
dc.subject.hlbtoplevel | Engineering | en_US |
dc.subject.hlbtoplevel | Science | en_US |
dc.subject.hlbtoplevel | Business | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | Department of Electrical Engineering and Computer Science, Center for Integrated Sensors and Circuits, University of Michigan, Ann Arbor, Michigan 48109-2122 | en_US |
dc.contributor.affiliationum | Chemistry Department, Center for Integrated Sensors and Circuits, University of Michigan, Ann Arbor, Michigan 48109-2122 | en_US |
dc.contributor.affiliationum | Department of Electrical Engineering and Computer Science, Center for Integrated Sensors and Circuits, University of Michigan, Ann Arbor, Michigan 48109-2122 ; Department of Electrical Engineering and Computer Science, Center for Integrated Sensors and Circuits, University of Michigan, Ann Arbor, Michigan 48109-2122 | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/38611/1/070430709_ftp.pdf | en_US |
dc.identifier.doi | http://dx.doi.org/10.1002/app.1991.070430709 | en_US |
dc.identifier.source | Journal of Applied Polymer Science | en_US |
dc.owningcollname | Interdisciplinary and Peer-Reviewed |
Files in this item
Remediation of Harmful Language
The University of Michigan Library aims to describe library materials in a way that respects the people and communities who create, use, and are represented in our collections. Report harmful or offensive language in catalog records, finding aids, or elsewhere in our collections anonymously through our metadata feedback form. More information at Remediation of Harmful Language.
Accessibility
If you are unable to use this file in its current format, please select the Contact Us link and we can modify it to make it more accessible to you.