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Comparative study of hot embossed micro structures fabricated by laboratory and commercial environments

dc.contributor.authorCheng, Y. -T.en_US
dc.contributor.authorLin, L.en_US
dc.contributor.authorChiu, C. -J.en_US
dc.date.accessioned2006-09-08T20:12:36Z
dc.date.available2006-09-08T20:12:36Z
dc.date.issued1998-05en_US
dc.identifier.citationLin, L.; Cheng, Y.-T.; Chiu, C.-J.; (1998). "Comparative study of hot embossed micro structures fabricated by laboratory and commercial environments." Microsystem Technologies 4(3): 113-116. <http://hdl.handle.net/2027.42/42317>en_US
dc.identifier.issn0946-7076en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/42317
dc.description.abstract Hot embossed microstructures fabricated by laboratory and commercial environments have been studied. The laboratory process uses silicon with micropyramid patterns as the mold insert. Fine replication by using Polymethyl Methacrylate (PMMA) has been achieved. The commercial process uses electroplated nickel as the mold insert. Polyvinyl Chloride (PVC), which has a lower glass transition point than PMMA, has been used as the raw material. Fabrication results show that the laboratory process, although taking about 2 hours long per run, can successfully replicate microstructures. The commercial process which takes only 1 minute per run may be fine tuned for good replication. Atomic Force Microscope (AFM) has been used to analyze the fabricated microstructures. It is found that the root mean square (r.m.s.) roughness of PMMA is about 4 nm and that of PVC is about 10–15 nm. Defects including voids and bumps on both PMMA and PVC films have been found.en_US
dc.format.extent652081 bytes
dc.format.extent3115 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.language.isoen_US
dc.publisherSpringer-Verlag; Springer-Verlag Berlin Heidelbergen_US
dc.subject.otherLegacyen_US
dc.titleComparative study of hot embossed micro structures fabricated by laboratory and commercial environmentsen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelElectrical Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Mechanical Engineering and Applied Mechanics University of Michigan 2350 Hayward Street, Ann Arbor, MI 48109, USA, USen_US
dc.contributor.affiliationumDepartment of Electrical Engineering and Computer Science University of Michigan 1301 Beal Avenue, Ann Arbor, MI 48109, USA, USen_US
dc.contributor.affiliationotherInstitute of Applied Mechanics, National Taiwan University, Taipei, Taiwan, 106, ROC, TWen_US
dc.contributor.affiliationumcampusAnn Arboren_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/42317/1/542-4-3-113_80040113.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1007/s005420050109en_US
dc.identifier.sourceMicrosystem Technologiesen_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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