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Active positioning device for a perimodiolar cochlear electrode array

dc.contributor.authorBhatti, P. T.en_US
dc.contributor.authorArcand, B. Y.en_US
dc.contributor.authorWang, J.en_US
dc.contributor.authorButala, N. V.en_US
dc.contributor.authorWise, K. D. (Kensall D.)en_US
dc.contributor.authorFriedrich, C. R.en_US
dc.date.accessioned2006-09-11T19:28:01Z
dc.date.available2006-09-11T19:28:01Z
dc.date.issued2004-10en_US
dc.identifier.citationArcand, B. Y.; Bhatti, P. T.; Butala, N. V.; Wang, J.; Friedrich, C. R.; Wise, K. D.; (2004). "Active positioning device for a perimodiolar cochlear electrode array." Microsystem Technologies 10 (6-7): 478-483. <http://hdl.handle.net/2027.42/47852>en_US
dc.identifier.issn0946-7076en_US
dc.identifier.issn1432-1858en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/47852
dc.description.abstractThe authors report on an actuated positioning device for a cochlear prosthesis insertion procedure. The device consists of multiple high-aspect ratio fluidic actuator chambers integrated with a high-density silicon cochlear electrode array and manufactured in a tapered-helix form. Actuation chambers with cross-sectional sizes as small as 40 × 200 μm and lengths of 30 mm have been fabricated using flexible polymers. The device will allow for low-resistance basilar insertion of a stimulating electrode array into the cochlea providing for deep, perimodiolar position considered most beneficial for auditory nerve stimulation, while minimizing intracochlear trauma. Experimental measurements, FEA analysis, and modeling demonstrate a viable and appropriate actuation method for a cochlear implant procedure.en_US
dc.format.extent394185 bytes
dc.format.extent3115 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.language.isoen_US
dc.publisherSpringer-Verlag; Springer-Verlag Berlin Heidelbergen_US
dc.subject.otherEngineeringen_US
dc.titleActive positioning device for a perimodiolar cochlear electrode arrayen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelElectrical Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumNSF Engineering Research Center for Wireless Integrated Microsystems, , University of Michigan, , Michigan, USAen_US
dc.contributor.affiliationumNSF Engineering Research Center for Wireless Integrated Microsystems, , University of Michigan, , Michigan, USAen_US
dc.contributor.affiliationumNSF Engineering Research Center for Wireless Integrated Microsystems, , University of Michigan, , Michigan, USAen_US
dc.contributor.affiliationotherNSF Engineering Research Center for Wireless Integrated Microsystems, Department of Mechanical Engineering, , Engineering Mechanics, Michigan Technological University, , 1400 Townsend Drive, Houghton, MI, 49931, USAen_US
dc.contributor.affiliationotherNSF Engineering Research Center for Wireless Integrated Microsystems, Department of Mechanical Engineering, , Engineering Mechanics, Michigan Technological University, , 1400 Townsend Drive, Houghton, MI, 49931, USAen_US
dc.contributor.affiliationotherNSF Engineering Research Center for Wireless Integrated Microsystems, Department of Mechanical Engineering, , Engineering Mechanics, Michigan Technological University, , 1400 Townsend Drive, Houghton, MI, 49931, USAen_US
dc.contributor.affiliationumcampusAnn Arboren_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/47852/1/542_2004_Article_376.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1007/s00542-004-0376-5en_US
dc.identifier.sourceMicrosystem Technologiesen_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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