The tailoring of impact ionization phenomenon using pseudomorphic structures-applications to InGaAlAs on GaAs and InP substrates

Singh, Jasprit

The tailoring of impact ionization phenomenon using pseudomorphic structures-applications to InGaAlAs on GaAs and InP substrates

dc.contributor.author	Singh, Jasprit	en_US
dc.date.accessioned	2006-12-19T19:00:17Z
dc.date.available	2006-12-19T19:00:17Z
dc.date.issued	1992-03-01	en_US
dc.identifier.citation	Singh, J (1992). "The tailoring of impact ionization phenomenon using pseudomorphic structures-applications to InGaAlAs on GaAs and InP substrates." Semiconductor Science and Technology. 7(3B): B509-B511. <http://hdl.handle.net/2027.42/48930>	en_US
dc.identifier.issn	0268-1242	en_US
dc.identifier.uri	https://hdl.handle.net/2027.42/48930
dc.description.abstract	The potential of utilizing strain for suppressing impact ionization is evaluated. It is found that if compressive strain is introduced without altering the bandgap (e.g. by using properly tailored InGaAlAs alloys) the threshold energy for electron impact ionization is significantly increased for both GaAs-based and InP-based materials.	en_US
dc.format.extent	3118 bytes
dc.format.extent	147164 bytes
dc.format.mimetype	text/plain
dc.format.mimetype	application/pdf
dc.language.iso	en_US
dc.publisher	IOP Publishing Ltd	en_US
dc.title	The tailoring of impact ionization phenomenon using pseudomorphic structures-applications to InGaAlAs on GaAs and InP substrates	en_US
dc.type	Article	en_US
dc.subject.hlbsecondlevel	Physics	en_US
dc.subject.hlbtoplevel	Science	en_US
dc.description.peerreviewed	Peer Reviewed	en_US
dc.contributor.affiliationother	Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA	en_US
dc.contributor.affiliationumcampus	Ann Arbor	en_US
dc.description.bitstreamurl	http://deepblue.lib.umich.edu/bitstream/2027.42/48930/2/ss920bd3.pdf	en_US
dc.identifier.doi	http://dx.doi.org/10.1088/0268-1242/7/3B/133	en_US
dc.identifier.source	Semiconductor Science and Technology.	en_US
dc.owningcollname	Interdisciplinary and Peer-Reviewed

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