Batch-assembled multi-level micromachined mechanisms from bulk silicon
dc.contributor.author | Gianchandani, Yogesh B. | en_US |
dc.contributor.author | Najafi, Khalil | en_US |
dc.date.accessioned | 2006-12-19T19:08:03Z | |
dc.date.available | 2006-12-19T19:08:03Z | |
dc.date.issued | 1992-06-01 | en_US |
dc.identifier.citation | Gianchandani, Y; Najafi, K (1992). "Batch-assembled multi-level micromachined mechanisms from bulk silicon." Journal of Micromechanics and Microengineering. 2(2): 80-85. <http://hdl.handle.net/2027.42/49023> | en_US |
dc.identifier.issn | 0960-1317 | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/49023 | |
dc.description.abstract | The authors report on the development of a new technology intended for the wafer level fabrication and assembly of fully integrated micromechanisms. The technology is based on a boron-doped bulk silicon dissolved wafer process that has been used to fabricate a variety of micromechanical devices. The overall process utilizes three wafers: two silicon and one glass. All the major mechanical elements, including gears and micromotors, are fabricated from one silicon wafer, whereas the mechanical links between these elements are fabricated from a second silicon wafer. These wafers are successively aligned and bonded to a glass wafer which forms the substrate and are then dissolved in EDP to free the mechanisms. This procedure permits wafer-level batch assembly of micromechanical systems. A number of bulk silicon electrostatic micromotors 5-10 mu m thick and gear trains have been fabricated and linked to each other on the same chip. | en_US |
dc.format.extent | 3118 bytes | |
dc.format.extent | 819292 bytes | |
dc.format.mimetype | text/plain | |
dc.format.mimetype | application/pdf | |
dc.language.iso | en_US | |
dc.publisher | IOP Publishing Ltd | en_US |
dc.title | Batch-assembled multi-level micromachined mechanisms from bulk silicon | en_US |
dc.type | Article | en_US |
dc.subject.hlbsecondlevel | Physics | en_US |
dc.subject.hlbtoplevel | Science | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationother | Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA | en_US |
dc.contributor.affiliationother | Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA | en_US |
dc.contributor.affiliationumcampus | Ann Arbor | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/49023/2/jm920203.pdf | en_US |
dc.identifier.doi | http://dx.doi.org/10.1088/0960-1317/2/2/003 | en_US |
dc.identifier.source | Journal of Micromechanics and Microengineering. | en_US |
dc.owningcollname | Interdisciplinary and Peer-Reviewed |
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