Porous silicon as a sacrificial material
dc.contributor.author | Bell, T. E. | en_US |
dc.contributor.author | Gennissen, P. T. J. | en_US |
dc.contributor.author | DeMunter, D. | en_US |
dc.contributor.author | Kuhl, M. | en_US |
dc.date.accessioned | 2006-12-19T19:08:08Z | |
dc.date.available | 2006-12-19T19:08:08Z | |
dc.date.issued | 1996-12-01 | en_US |
dc.identifier.citation | Bell, T E; Gennissen, P T J; DeMunter, D; Kuhl, M (1996). "Porous silicon as a sacrificial material ." Journal of Micromechanics and Microengineering. 6(4): 361-369. <http://hdl.handle.net/2027.42/49024> | en_US |
dc.identifier.issn | 0960-1317 | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/49024 | |
dc.description.abstract | Porous silicon is emerging in micromachining technology as an excellent material for use as a sacrificial layer. This is largely due to the ease of fabrication and freedom of design it allows. The rate of pore formation is heavily dependent upon the doping type and concentration of the silicon, allowing patterned porous silicon formation through selective doping of the substrate. Etch-rates above have been reported for highly doped material. Silicon that has been made porous can be quickly and easily removed in a dilute hydroxide solution, as low as 1%. Porous silicon technology offers the unique ability to fabricate free-standing structures in single-crystal silicon with separation distances from the substrate ranging from a few microns to over one hundred microns. A review of the development of porous silicon for micromachining applications is given. | en_US |
dc.format.extent | 3118 bytes | |
dc.format.extent | 796093 bytes | |
dc.format.mimetype | text/plain | |
dc.format.mimetype | application/pdf | |
dc.language.iso | en_US | |
dc.publisher | IOP Publishing Ltd | en_US |
dc.title | Porous silicon as a sacrificial material | en_US |
dc.type | Article | en_US |
dc.subject.hlbsecondlevel | Physics | en_US |
dc.subject.hlbtoplevel | Science | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | University of Michigan, Department of Electrical Engineering and Computer Science, Ann Arbor, MI, USA | en_US |
dc.contributor.affiliationother | Laboratory for Electronic Instrumentation, Department of Electrical Engineering, Delft University of Technology, The Netherlands | en_US |
dc.contributor.affiliationother | Laboratory for Electronic Instrumentation, Department of Electrical Engineering, Delft University of Technology, The Netherlands | en_US |
dc.contributor.affiliationother | Technical University of Chemnitz-Zwickau, Department of Electrical Engineering, Centre of Microtechnology, 09107, Chemnitz, Germany | en_US |
dc.contributor.affiliationumcampus | Ann Arbor | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/49024/2/jm6401.pdf | en_US |
dc.identifier.doi | http://dx.doi.org/10.1088/0960-1317/6/4/002 | en_US |
dc.identifier.source | Journal of Micromechanics and Microengineering. | en_US |
dc.owningcollname | Interdisciplinary and Peer-Reviewed |
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