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dc.contributor.authorZiaie, Babaken_US
dc.contributor.authorNajafi, Khalilen_US
dc.date.accessioned2006-12-19T19:08:18Z
dc.date.available2006-12-19T19:08:18Z
dc.date.issued2000-09-01en_US
dc.identifier.citationZiaie, Babak; Najafi, Khalil (2000). "A generic micromachined silicon platform for high-performance RF passive components." Journal of Micromechanics and Microengineering. 10(3): 365-371. <http://hdl.handle.net/2027.42/49026>en_US
dc.identifier.issn0960-1317en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/49026
dc.description.abstractThis paper describes the development of a micromachined silicon platform fabricated using the dissolved wafer process that supports: (1) high self-resonance frequency and quality factor inductors suspended on a dielectric membrane, (2) low-loss thin-film capacitors, and (3) polysilicon resistors. The process uses deep boron diffusion to create silicon anchors, which support a stress compensated dielectric membrane. A thick resist mold is used to gold electroplate the inductor, top capacitor plate, and bonding pads. This platform can be used to build miniature high-performance transceivers or other RF subsystems using either hybrid-attached surface-mount components or flip-chip bonded RF circuits. Using this technique, a Colpitts transmitter with a five-turn dielectric suspended inductor was designed and fabricated. The transmitter oscillates in the frequency band of 275-375 MHz, consumes 200 µA when operated continuously and 100 µA when amplitude modulated (on-off keying) at a rate of 1 Mbps (50% duty cycle).en_US
dc.format.extent3118 bytes
dc.format.extent301708 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherIOP Publishing Ltden_US
dc.titleA generic micromachined silicon platform for high-performance RF passive componentsen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Electrical Engineering and Computer Science, Centre for Integrated Microsystems, University of Michigan, Ann Arbor, MI, USAen_US
dc.contributor.affiliationotherDepartment of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN, USAen_US
dc.contributor.affiliationumcampusAnn Arboren_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/49026/2/jm0310.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1088/0960-1317/10/3/310en_US
dc.identifier.sourceJournal of Micromechanics and Microengineering.en_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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