Silicon-processed plastic micropyramids for brightness enhancement applications

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dc.contributor.author Lin, Liwei en_US
dc.contributor.author Shia, T. K. en_US
dc.contributor.author Chiu, C. -J. en_US
dc.date.accessioned 2006-12-19T19:08:28Z
dc.date.available 2006-12-19T19:08:28Z
dc.date.issued 2000-09-01 en_US
dc.identifier.citation Lin, Liwei; Shia, T K; Chiu, C-J (2000). "Silicon-processed plastic micropyramids for brightness enhancement applications." Journal of Micromechanics and Microengineering. 10(3): 395-400. <http://hdl.handle.net/2027.42/49028> en_US
dc.identifier.issn 0960-1317 en_US
dc.identifier.uri http://hdl.handle.net/2027.42/49028
dc.description.abstract A combination of silicon anisotropic etch and mechanical hot embossing techniques is used to demonstrate the feasibility of manufacturing plastic micropyramids. These micropyramids have the desirable optical characteristics to enhance the brightness of LCD (liquid crystal displays) in battery-powered laptop computers, personal TVs and camcorders. Silicon mold inserts, 4-inch in diameter, are first micromachined and used directly in the micro hot embossing process by applying plastic sheets made of polymethyl methacrylate (PMMA) or polyvinyl chloride (PVC). Micropyramids which have base widths of 30 µm, heights of 21 µm and apex angles of 70° are hot embossed on the surface of plastic sheets. The fabricated plastic films are tested optically and the results show that up to 20% brightness enhancement within the front viewing angles of ±35° have been achieved. An optical model has been established to simulate the brightness enhancement effects and it is concluded that the optimal pyramid angle for the brightness enhancement application is 90°. en_US
dc.format.extent 3118 bytes
dc.format.extent 342201 bytes
dc.format.mimetype text/plain
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.publisher IOP Publishing Ltd en_US
dc.title Silicon-processed plastic micropyramids for brightness enhancement applications en_US
dc.type Article en_US
dc.subject.hlbsecondlevel Physics en_US
dc.subject.hlbtoplevel Science en_US
dc.description.peerreviewed Peer Reviewed en_US
dc.contributor.affiliationum Department of Mechanical Engineering and Applied Mechanics, University of Michigan, USA; en_US
dc.contributor.affiliationum Department of Mechanical Engineering and Applied Mechanics, University of Michigan, USA en_US
dc.contributor.affiliationother Institute of Applied Mechanics, National Taiwan University, Taipei, Taiwan en_US
dc.description.bitstreamurl http://deepblue.lib.umich.edu/bitstream/2027.42/49028/2/jm0314.pdf en_US
dc.identifier.doi http://dx.doi.org/10.1088/0960-1317/10/3/314 en_US
dc.identifier.source Journal of Micromechanics and Microengineering. en_US
dc.owningcollname Interdisciplinary and Peer-Reviewed
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