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dc.contributor.authorLin, Liweien_US
dc.contributor.authorShia, T. K.en_US
dc.contributor.authorChiu, C. -J.en_US
dc.date.accessioned2006-12-19T19:08:28Z
dc.date.available2006-12-19T19:08:28Z
dc.date.issued2000-09-01en_US
dc.identifier.citationLin, Liwei; Shia, T K; Chiu, C-J (2000). "Silicon-processed plastic micropyramids for brightness enhancement applications." Journal of Micromechanics and Microengineering. 10(3): 395-400. <http://hdl.handle.net/2027.42/49028>en_US
dc.identifier.issn0960-1317en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/49028
dc.description.abstractA combination of silicon anisotropic etch and mechanical hot embossing techniques is used to demonstrate the feasibility of manufacturing plastic micropyramids. These micropyramids have the desirable optical characteristics to enhance the brightness of LCD (liquid crystal displays) in battery-powered laptop computers, personal TVs and camcorders. Silicon mold inserts, 4-inch in diameter, are first micromachined and used directly in the micro hot embossing process by applying plastic sheets made of polymethyl methacrylate (PMMA) or polyvinyl chloride (PVC). Micropyramids which have base widths of 30 µm, heights of 21 µm and apex angles of 70° are hot embossed on the surface of plastic sheets. The fabricated plastic films are tested optically and the results show that up to 20% brightness enhancement within the front viewing angles of ±35° have been achieved. An optical model has been established to simulate the brightness enhancement effects and it is concluded that the optimal pyramid angle for the brightness enhancement application is 90°.en_US
dc.format.extent3118 bytes
dc.format.extent342201 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherIOP Publishing Ltden_US
dc.titleSilicon-processed plastic micropyramids for brightness enhancement applicationsen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Mechanical Engineering and Applied Mechanics, University of Michigan, USA;en_US
dc.contributor.affiliationumDepartment of Mechanical Engineering and Applied Mechanics, University of Michigan, USAen_US
dc.contributor.affiliationotherInstitute of Applied Mechanics, National Taiwan University, Taipei, Taiwanen_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/49028/2/jm0314.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1088/0960-1317/10/3/314en_US
dc.identifier.sourceJournal of Micromechanics and Microengineering.en_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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