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A wide-range micromachined threshold accelerometer array and interface circuit

dc.contributor.authorSelvakumar, Arjunen_US
dc.contributor.authorYazdi, Naviden_US
dc.contributor.authorNajafi, Khalilen_US
dc.date.accessioned2006-12-19T19:08:34Z
dc.date.available2006-12-19T19:08:34Z
dc.date.issued2001-03-01en_US
dc.identifier.citationSelvakumar, Arjun; Yazdi, Navid; Najafi, Khalil (2001). "A wide-range micromachined threshold accelerometer array and interface circuit." Journal of Micromechanics and Microengineering. 11(2): 118-125. <http://hdl.handle.net/2027.42/49029>en_US
dc.identifier.issn0960-1317en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/49029
dc.description.abstractThis paper presents a complete threshold acceleration detection microsystem comprising an array of threshold accelerometers and a low power interface circuit. The sensors were designed and fabricated using the bulk-silicon dissolved-wafer process. The process offers a wide latitude in sensor threshold levels, as demonstrated in the fabrication of devices with levels of 1.5-1000 g, bandwidths of 45 Hz to 40 kHz, with mass sizes ranging from 0.015 µg to 0.7 µg, and low-resistance gold-gold contacts for the switch. The interface circuit dissipates less than 300 µW, measures 2.2 mm×2.2 mm; it was fabricated in-house using a standard 3 µm, p-well CMOS (complementary metal oxide semiconductor) process, and is connected to the sensor chip in a multi-chip module. The key aspects of the microsystem are the implementation of sensor redundancy and supporting circuit logic to improve detection accuracy and fault tolerance, which are crucial factors in many applications. In addition, the microsystem supports communication with a standard microcontroller bus in a smart sensor network.en_US
dc.format.extent3118 bytes
dc.format.extent661904 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherIOP Publishing Ltden_US
dc.titleA wide-range micromachined threshold accelerometer array and interface circuiten_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumCenter for Integrated Microsystems, University of Michigan, Ann Arbor, MI 48109-2122, USAen_US
dc.contributor.affiliationotherInput/Output, Inc., Stafford, TX, USAen_US
dc.contributor.affiliationotherArizona State University, Tempe, AZ, USAen_US
dc.contributor.affiliationumcampusAnn Arboren_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/49029/2/jm1206.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1088/0960-1317/11/2/306en_US
dc.identifier.sourceJournal of Micromechanics and Microengineering.en_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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