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dc.contributor.authorChae, Junseoken_US
dc.contributor.authorKulah, Haluken_US
dc.contributor.authorNajafi, Khalilen_US
dc.date.accessioned2006-12-19T19:09:13Z
dc.date.available2006-12-19T19:09:13Z
dc.date.issued2005-02-01en_US
dc.identifier.citationChae, Junseok; Kulah, Haluk; Najafi, Khalil (2005). "A CMOS-compatible high aspect ratio silicon-on-glass in-plane micro-accelerometer." Journal of Micromechanics and Microengineering. 15(2): 336-345. <http://hdl.handle.net/2027.42/49037>en_US
dc.identifier.issn0960-1317en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/49037
dc.description.abstractThis paper presents a post-CMOS-compatible micro-machined silicon-on-glass (SOG) in-plane capacitive accelerometer. The accelerometer is a high aspect ratio structure with a 120 µm thick single-crystal silicon proof-mass and 3.4 µm sense gap, bonded to a glass substrate. It is fabricated using a simple 3-mask, 5-step process, and is fully CMOS compatible. A CMOS switched-capacitor readout circuit and an oversampled Σ–delta modulator are used to read out capacitance changes from the accelerometer. The CMOS chip is 2.6 × 2.4 mm2 in size, utilizes chopper stabilization and correlated double sampling techniques, has a 106 dB open-loop dynamic range, a low input offset of 370 µV, and can resolve better than 20 aF. The accelerometer system has a measured sensitivity of 40 mV g−1 and input referred noise density of 79 µg Hz−1/2. Using the SOG configuration, a post-CMOS monolithic integration technique is developed. The integration technique utilizes dielectric bridges, silicon islands and the SOG configuration to obtain a simple, robust and post-CMOS-compatible process. Utilizing this technique, an integrated SOG accelerometer has been fabricated using the University of Michigan 3 µm CMOS process.en_US
dc.format.extent3118 bytes
dc.format.extent1820125 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherIOP Publishing Ltden_US
dc.titleA CMOS-compatible high aspect ratio silicon-on-glass in-plane micro-accelerometeren_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48109-2122, USAen_US
dc.contributor.affiliationumDepartment of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48109-2122, USAen_US
dc.contributor.affiliationumDepartment of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48109-2122, USAen_US
dc.contributor.affiliationumcampusAnn Arboren_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/49037/2/jmm5_2_013.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1088/0960-1317/15/2/013en_US
dc.identifier.sourceJournal of Micromechanics and Microengineering.en_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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