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A silicon micromachined microphone for fluid mechanics research

dc.contributor.authorHuang, Chunchiehen_US
dc.contributor.authorNaguib, Ahmeden_US
dc.contributor.authorSoupos, Eliasen_US
dc.contributor.authorNajafi, Khalilen_US
dc.date.accessioned2006-12-19T19:09:19Z
dc.date.available2006-12-19T19:09:19Z
dc.date.issued2002-11-01en_US
dc.identifier.citationHuang, Chunchieh; Naguib, Ahmed; Soupos, Elias; Najafi, Khalil (2002). "A silicon micromachined microphone for fluid mechanics research." Journal of Micromechanics and Microengineering. 12(6): 767-774. <http://hdl.handle.net/2027.42/49038>en_US
dc.identifier.issn0960-1317en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/49038
dc.description.abstractMEMS piezoresistive sound detectors have been fabricated using the dissolved wafer process for the first time. The sensors utilize stress compensated PECVD ultra-thin silicon-nitride/oxide membrane together with monocrystalline ion-implanted p++ silicon piezoresistors to achieve high sensitivity. Tests reveal that sensors with a diaphragm size of 710 μm have a static sensitivity of 1.1 μV VPa−1 with 2% non-linearity over an operating pressure range of 10 kPa. This sensitivity is substantially larger than that of commercially available microfabricated sensors. Furthermore, the new sensor's dynamic response is found to be flat (within ±2.5 dB) over a frequency range extending up to 10 kHz. This paper contributes to existing literature in the field by demonstrating a new way of fabricating capable MEMS piezoresistive pressure sensors, hence adding to the overall versatility of the technology and associated range of applications.en_US
dc.format.extent3118 bytes
dc.format.extent793686 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherIOP Publishing Ltden_US
dc.titleA silicon micromachined microphone for fluid mechanics researchen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumCenter for Wireless Integrated MicroSystems, University of Michigan, 1301 Beal Avenue, Ann Arbor, MI 48109-2122, USAen_US
dc.contributor.affiliationumCenter for Wireless Integrated MicroSystems, University of Michigan, 1301 Beal Avenue, Ann Arbor, MI 48109-2122, USAen_US
dc.contributor.affiliationotherMechanical Engineering Department, Michigan State University, East Lansing, MI 48824-1226, USAen_US
dc.contributor.affiliationotherMechanical Materials and Aerospace Engineering Department, Illinois Institute of Technology, Chicago, IL 60616, USAen_US
dc.contributor.affiliationumcampusAnn Arboren_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/49038/2/jm2607.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1088/0960-1317/12/6/307en_US
dc.identifier.sourceJournal of Micromechanics and Microengineering.en_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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