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Implementation and analysis of polymeric microstructure replication by micro injection molding

dc.contributor.authorSu, Yu-Chuanen_US
dc.contributor.authorShah, Jatanen_US
dc.contributor.authorLin, Liweien_US
dc.date.accessioned2006-12-19T19:09:50Z
dc.date.available2006-12-19T19:09:50Z
dc.date.issued2004-03-01en_US
dc.identifier.citationSu, Yu-Chuan; Shah, Jatan; Lin, Liwei (2004). "Implementation and analysis of polymeric microstructure replication by micro injection molding." Journal of Micromechanics and Microengineering. 14(3): 415-422. <http://hdl.handle.net/2027.42/49044>en_US
dc.identifier.issn0960-1317en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/49044
dc.description.abstractThis paper presents the adaptation of a conventional injection molding process to the mass replication of polymeric microstructures with appropriate mold design and process control. Using wet-etched silicon wafers with microstructures on the surfaces as mold inserts, we have successfully predicted, improved and optimized the replication results. The flow behaviors of polymer melts in micro mold-cavities are characterized by both simulation and experiments. Among various process parameters, temperature is identified as the key factor that decisively determines the quality of injection-molded microstructures. Based on the collected experimental and simulation results, process optimization is performed to improve replication quality and to establish guidelines for potential applications. Because of its high speed and low cost, the adaptation of the injection molding process to microfabrication will lead to a promising technology for MEMS applications.en_US
dc.format.extent3118 bytes
dc.format.extent928164 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherIOP Publishing Ltden_US
dc.titleImplementation and analysis of polymeric microstructure replication by micro injection moldingen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Mechanical Engineering, University of Michigan, Ann Arbor, MI 48105, USAen_US
dc.contributor.affiliationotherBerkeley Sensor & Actuator Center, University of California, Berkeley, CA 94720, USA; Department of Mechanical Engineering, University of California, Berkeley, CA 94720, USAen_US
dc.contributor.affiliationotherBerkeley Sensor & Actuator Center, University of California, Berkeley, CA 94720, USA; Department of Mechanical Engineering, University of California, Berkeley, CA 94720, USAen_US
dc.contributor.affiliationumcampusAnn Arboren_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/49044/2/jmm4_3_015.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1088/0960-1317/14/3/015en_US
dc.identifier.sourceJournal of Micromechanics and Microengineering.en_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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