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Full-wave electromagnetic and thermal modeling for the prediction of heat-dissipation-induced RF-MEMS switch failure

dc.contributor.authorJensen, Brian D.en_US
dc.contributor.authorChow, Linda L. W.en_US
dc.contributor.authorVolakis, John Leonidasen_US
dc.contributor.authorWang, Zhongdeen_US
dc.contributor.authorSaitou, Kazuhiroen_US
dc.contributor.authorKurabayashi, Katsuoen_US
dc.date.accessioned2006-12-19T19:10:04Z
dc.date.available2006-12-19T19:10:04Z
dc.date.issued2006-01-01en_US
dc.identifier.citationWang, Zhongde; Jensen, Brian D; Chow, Linda L W; Volakis, John L; Saitou, Kazuhiro; Kurabayashi, Katsuo (2006). "Full-wave electromagnetic and thermal modeling for the prediction of heat-dissipation-induced RF-MEMS switch failureThis work was supported in part by the National Science Foundation under grant no ECS-01152222.." Journal of Micromechanics and Microengineering. 16(1): 157-164. <http://hdl.handle.net/2027.42/49047>en_US
dc.identifier.issn0960-1317en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/49047
dc.description.abstractWe propose an extended finite element-boundary integral method (EFE-BI) to model the electromagnetic (EM) behavior of RF-MEMS switches over a wide frequency range from UHF to terahertz. Our new method integrates EM with finite element heat transfer analysis to extract heat dissipation on the micrometer-scale switch beam due to the non-uniform radio frequency (RF) current distribution. The developed EFE-BI technique is an extension of the standard finite element-boundary integral (FE-BI) method to allow for accurate characterization of RF-MEMS structures whose entire size is a small fraction of a wavelength (λ/250 or less) and may contain dimensions in the order of λ/50 000 or less. Our model predictions exhibit good agreement with experimental results obtained independent of the current study.en_US
dc.format.extent3118 bytes
dc.format.extent599276 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherIOP Publishing Ltden_US
dc.titleFull-wave electromagnetic and thermal modeling for the prediction of heat-dissipation-induced RF-MEMS switch failureen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumElectrical Engineering and Computer Science Department, University of Michigan, Ann Arbor, MI 48109, USAen_US
dc.contributor.affiliationumMechanical Engineering Department, University of Michigan, Ann Arbor, MI 48109, USAen_US
dc.contributor.affiliationumMechanical Engineering Department, University of Michigan, Ann Arbor, MI 48109, USAen_US
dc.contributor.affiliationumMechanical Engineering Department, University of Michigan, Ann Arbor, MI 48109, USAen_US
dc.contributor.affiliationumMechanical Engineering Department, University of Michigan, Ann Arbor, MI 48109, USAen_US
dc.contributor.affiliationotherElectrical and Computer Engineering Department, The Ohio State University, Columbus, OH 43210, USAen_US
dc.contributor.affiliationumcampusAnn Arboren_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/49047/2/jmm6_1_021.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1088/0960-1317/16/1/021en_US
dc.identifier.sourceJournal of Micromechanics and Microengineering.en_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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