Full-wave electromagnetic and thermal modeling for the prediction of heat-dissipation-induced RF-MEMS switch failure
dc.contributor.author | Jensen, Brian D. | en_US |
dc.contributor.author | Chow, Linda L. W. | en_US |
dc.contributor.author | Volakis, John Leonidas | en_US |
dc.contributor.author | Wang, Zhongde | en_US |
dc.contributor.author | Saitou, Kazuhiro | en_US |
dc.contributor.author | Kurabayashi, Katsuo | en_US |
dc.date.accessioned | 2006-12-19T19:10:04Z | |
dc.date.available | 2006-12-19T19:10:04Z | |
dc.date.issued | 2006-01-01 | en_US |
dc.identifier.citation | Wang, Zhongde; Jensen, Brian D; Chow, Linda L W; Volakis, John L; Saitou, Kazuhiro; Kurabayashi, Katsuo (2006). "Full-wave electromagnetic and thermal modeling for the prediction of heat-dissipation-induced RF-MEMS switch failureThis work was supported in part by the National Science Foundation under grant no ECS-01152222.." Journal of Micromechanics and Microengineering. 16(1): 157-164. <http://hdl.handle.net/2027.42/49047> | en_US |
dc.identifier.issn | 0960-1317 | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/49047 | |
dc.description.abstract | We propose an extended finite element-boundary integral method (EFE-BI) to model the electromagnetic (EM) behavior of RF-MEMS switches over a wide frequency range from UHF to terahertz. Our new method integrates EM with finite element heat transfer analysis to extract heat dissipation on the micrometer-scale switch beam due to the non-uniform radio frequency (RF) current distribution. The developed EFE-BI technique is an extension of the standard finite element-boundary integral (FE-BI) method to allow for accurate characterization of RF-MEMS structures whose entire size is a small fraction of a wavelength (λ/250 or less) and may contain dimensions in the order of λ/50 000 or less. Our model predictions exhibit good agreement with experimental results obtained independent of the current study. | en_US |
dc.format.extent | 3118 bytes | |
dc.format.extent | 599276 bytes | |
dc.format.mimetype | text/plain | |
dc.format.mimetype | application/pdf | |
dc.language.iso | en_US | |
dc.publisher | IOP Publishing Ltd | en_US |
dc.title | Full-wave electromagnetic and thermal modeling for the prediction of heat-dissipation-induced RF-MEMS switch failure | en_US |
dc.type | Article | en_US |
dc.subject.hlbsecondlevel | Physics | en_US |
dc.subject.hlbtoplevel | Science | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | Electrical Engineering and Computer Science Department, University of Michigan, Ann Arbor, MI 48109, USA | en_US |
dc.contributor.affiliationum | Mechanical Engineering Department, University of Michigan, Ann Arbor, MI 48109, USA | en_US |
dc.contributor.affiliationum | Mechanical Engineering Department, University of Michigan, Ann Arbor, MI 48109, USA | en_US |
dc.contributor.affiliationum | Mechanical Engineering Department, University of Michigan, Ann Arbor, MI 48109, USA | en_US |
dc.contributor.affiliationum | Mechanical Engineering Department, University of Michigan, Ann Arbor, MI 48109, USA | en_US |
dc.contributor.affiliationother | Electrical and Computer Engineering Department, The Ohio State University, Columbus, OH 43210, USA | en_US |
dc.contributor.affiliationumcampus | Ann Arbor | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/49047/2/jmm6_1_021.pdf | en_US |
dc.identifier.doi | http://dx.doi.org/10.1088/0960-1317/16/1/021 | en_US |
dc.identifier.source | Journal of Micromechanics and Microengineering. | en_US |
dc.owningcollname | Interdisciplinary and Peer-Reviewed |
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