View Item 

Show simple item record

An integrated vapor source with a porous silicon wick
dc.contributor.authorWallner, J. Z.en_US
dc.contributor.authorKunt, K. S.en_US
dc.contributor.authorObanionwu, H.en_US
dc.contributor.authorOborny, M. C.en_US
dc.contributor.authorBergstrom, P. L.en_US
dc.contributor.authorZellers, Edward T.en_US
dc.date.accessioned2007-09-20T18:41:54Z
dc.date.available2008-09-08T14:25:14Zen_US
dc.date.issued2007-05en_US
dc.identifier.citationWallner, J. Z.; Kunt, K. S.; Obanionwu, H.; Oborny, M. C.; Bergstrom, P. L.; Zellers, E. T. (2007)."An integrated vapor source with a porous silicon wick." physica status solidi a 204(5): 1449-1453. <http://hdl.handle.net/2027.42/56056>en_US
dc.identifier.issn0031-8965en_US
dc.identifier.issn1521-396Xen_US
dc.identifier.urihttps://hdl.handle.net/2027.42/56056
dc.description.abstractA micro vapor source has been developed for calibrating micro gas chromatograph (ΜGC) systems. By utilizing a porous silicon wick in a micro diffusion system, vapor generation with excellent stability has been achieved. The source has shown uniform and repeatable vapor generation for n-decane with less than a 0.1% variation in 9 hours, and less than a 0.5% variation in rate over 7 days. The evolution rate follows the diffusion model as expected, although the room temperature rate is higher than theoretically predicted. Equipped with a refillable reservoir, this vapor source is suitable for extended ΜGC field deployment. (© 2007 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)en_US
dc.format.extent629526 bytes
dc.format.extent3118 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.publisherWILEY-VCH Verlagen_US
dc.subject.otherPhysicsen_US
dc.titleAn integrated vapor source with a porous silicon wicken_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbsecondlevelElectrical Engineering and Computer Scienceen_US
dc.subject.hlbsecondlevelMaterials Science and Engineeringen_US
dc.subject.hlbtoplevelScienceen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Electrical and Computer Engineering, Michigan Technological University, 1400 Townsend Drive, Houghton, MI 49931-1295, USA ; Engineering Research Center for Wireless Integrated MicroSystems, the University of Michigan, Ann Arbor, MI, USA ; Phone: +1 906 487 2550, Fax: +1 906 487 2949en_US
dc.contributor.affiliationumEngineering Research Center for Wireless Integrated MicroSystems, the University of Michigan, Ann Arbor, MI, USAen_US
dc.contributor.affiliationumEngineering Research Center for Wireless Integrated MicroSystems, the University of Michigan, Ann Arbor, MI, USAen_US
dc.contributor.affiliationumEngineering Research Center for Wireless Integrated MicroSystems, the University of Michigan, Ann Arbor, MI, USA ; Sandia National Laboratories, Albuquerque, NM, USAen_US
dc.contributor.affiliationumDepartment of Electrical and Computer Engineering, Michigan Technological University, 1400 Townsend Drive, Houghton, MI 49931-1295, USA ; Engineering Research Center for Wireless Integrated MicroSystems, the University of Michigan, Ann Arbor, MI, USAen_US
dc.contributor.affiliationumEngineering Research Center for Wireless Integrated MicroSystems, the University of Michigan, Ann Arbor, MI, USAen_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/56056/1/1449_ftp.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1002/pssa.200674383en_US
dc.identifier.sourcephysica status solidi aen_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


Files in this item

Name:
1449_ftp.pdf
Size:
614.7KB
Format:
PDF
View/Open

Show simple item record

Remediation of Harmful Language

The University of Michigan Library aims to describe library materials in a way that respects the people and communities who create, use, and are represented in our collections. Report harmful or offensive language in catalog records, finding aids, or elsewhere in our collections anonymously through our metadata feedback form. More information at Remediation of Harmful Language.

Accessibility

If you are unable to use this file in its current format, please select the Contact Us link and we can modify it to make it more accessible to you.