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GaN/air gap based micro-opto-electro-mechanical (MOEM) Fabry-PÉrot filters

dc.contributor.authorCho, E.en_US
dc.contributor.authorPavlidis, Dimitrisen_US
dc.contributor.authorSillero, E.en_US
dc.date.accessioned2007-09-20T18:54:25Z
dc.date.available2008-09-08T14:25:12Zen_US
dc.date.issued2007-06en_US
dc.identifier.citationCho, E.; Pavlidis, D.; Sillero, E. (2007)."GaN/air gap based micro-opto-electro-mechanical (MOEM) Fabry-PÉrot filters." physica status solidi c 4(7): 2764-2767. <http://hdl.handle.net/2027.42/56100>en_US
dc.identifier.issn1610-1634en_US
dc.identifier.issn1610-1642en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/56100
dc.description.abstractStructural and optical properties of Fabry-PÉrot filters (FPFs) with GaN/air gap based distributed Bragg reflectors (DBRs) were studied. Reflectance of GaN/air gap DBRs on sapphire substrate was calculated from the standard transmission matrix method and results showed that 98% reflectance is achievable with only 3.5 pairs at a center wavelength of 450 nm. The thickness of the GaN layer and the first AlN layer was determined according to the deformation induced by the residual stress. In-plane strain corresponding to growth conditions and the thickness of the GaN epilayer was considered for this analysis. Optical tuning efficiency and spectral range were found to be 0.27 and 25 nm respectively for FPFs with GaN/air gap (322 nm/113 nm) based DBRs and a Λ 0 /2 air resonant cavity. The calculated pull-in voltage was 1.5 V. Crack free AlN grown on GaN by in-house MOCVD showed an etching rate of 0.2 nm/min. (© 2007 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)en_US
dc.format.extent174838 bytes
dc.format.extent3118 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.publisherWILEY-VCH Verlagen_US
dc.subject.otherPhysicsen_US
dc.titleGaN/air gap based micro-opto-electro-mechanical (MOEM) Fabry-PÉrot filtersen_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbsecondlevelElectrical Engineering and Computer Scienceen_US
dc.subject.hlbsecondlevelMaterials Science and Engineeringen_US
dc.subject.hlbtoplevelScienceen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of High Frequency Electronics, Technische UniversitÄt Darmstadt, Merckstrasse 25, 64283 Darmstadt, Germany ; Department of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48109-2122, USA ; Phone: +49 6151 16 4162, Fax: +49 6151 16 4367en_US
dc.contributor.affiliationumDepartment of High Frequency Electronics, Technische UniversitÄt Darmstadt, Merckstrasse 25, 64283 Darmstadt, Germany ; Department of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48109-2122, USAen_US
dc.contributor.affiliationotherInstituto de Sistemas OptoelectrÓnicos y MicrotecnologÍa and Department of Electronic Engineering, Universidad PolitÉcnica de Madrid, 28040 Madrid, Spainen_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/56100/1/2764_ftp.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1002/pssc.200674730en_US
dc.identifier.sourcephysica status solidi cen_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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