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Fatigue Crack Growth of Silicon Nitride at 1400°C: A Novel Fatigue-Induced Crack-Tip Bridging Phenomenon

dc.contributor.authorLiu, Shih-Yuen_US
dc.contributor.authorChen, I-Weien_US
dc.contributor.authorTien, Tseng-Yingen_US
dc.date.accessioned2010-04-01T14:50:33Z
dc.date.available2010-04-01T14:50:33Z
dc.date.issued1994-01en_US
dc.identifier.citationLiu, Shih-Yu; Chen, I-Wei; Tien, Tseng-Ying (1994). "Fatigue Crack Growth of Silicon Nitride at 1400°C: A Novel Fatigue-Induced Crack-Tip Bridging Phenomenon." Journal of the American Ceramic Society 77(1): 137-142. <http://hdl.handle.net/2027.42/65294>en_US
dc.identifier.issn0002-7820en_US
dc.identifier.issn1551-2916en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/65294
dc.format.extent744984 bytes
dc.format.extent3110 bytes
dc.format.mimetypeapplication/pdf
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dc.publisherBlackwell Publishing Ltden_US
dc.rights1994 by The American Ceramic Societyen_US
dc.titleFatigue Crack Growth of Silicon Nitride at 1400°C: A Novel Fatigue-Induced Crack-Tip Bridging Phenomenonen_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelMaterials Science and Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Materials Science and Engineering The University of Michigan, Ann Arbor, Michigan 48109-2136Men_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/65294/1/j.1151-2916.1994.tb06967.x.pdf
dc.identifier.doi10.1111/j.1151-2916.1994.tb06967.xen_US
dc.identifier.sourceJournal of the American Ceramic Societyen_US
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dc.owningcollnameInterdisciplinary and Peer-Reviewed


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