Fatigue Crack Growth of Silicon Nitride at 1400°C: A Novel Fatigue-Induced Crack-Tip Bridging Phenomenon
dc.contributor.author | Liu, Shih-Yu | en_US |
dc.contributor.author | Chen, I-Wei | en_US |
dc.contributor.author | Tien, Tseng-Ying | en_US |
dc.date.accessioned | 2010-04-01T14:50:33Z | |
dc.date.available | 2010-04-01T14:50:33Z | |
dc.date.issued | 1994-01 | en_US |
dc.identifier.citation | Liu, Shih-Yu; Chen, I-Wei; Tien, Tseng-Ying (1994). "Fatigue Crack Growth of Silicon Nitride at 1400°C: A Novel Fatigue-Induced Crack-Tip Bridging Phenomenon." Journal of the American Ceramic Society 77(1): 137-142. <http://hdl.handle.net/2027.42/65294> | en_US |
dc.identifier.issn | 0002-7820 | en_US |
dc.identifier.issn | 1551-2916 | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/65294 | |
dc.format.extent | 744984 bytes | |
dc.format.extent | 3110 bytes | |
dc.format.mimetype | application/pdf | |
dc.format.mimetype | text/plain | |
dc.publisher | Blackwell Publishing Ltd | en_US |
dc.rights | 1994 by The American Ceramic Society | en_US |
dc.title | Fatigue Crack Growth of Silicon Nitride at 1400°C: A Novel Fatigue-Induced Crack-Tip Bridging Phenomenon | en_US |
dc.type | Article | en_US |
dc.rights.robots | IndexNoFollow | en_US |
dc.subject.hlbsecondlevel | Materials Science and Engineering | en_US |
dc.subject.hlbtoplevel | Engineering | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | Department of Materials Science and Engineering The University of Michigan, Ann Arbor, Michigan 48109-2136M | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/65294/1/j.1151-2916.1994.tb06967.x.pdf | |
dc.identifier.doi | 10.1111/j.1151-2916.1994.tb06967.x | en_US |
dc.identifier.source | Journal of the American Ceramic Society | en_US |
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dc.owningcollname | Interdisciplinary and Peer-Reviewed |
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