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A novel processing technique for fabrication of flexible YBa2Cu3O7−x wire

dc.contributor.authorSamanta, Shyam K.en_US
dc.contributor.authorSamajdar, S.en_US
dc.contributor.authorDurrant, W.en_US
dc.contributor.authorGupta, M.en_US
dc.date.accessioned2010-05-06T20:35:23Z
dc.date.available2010-05-06T20:35:23Z
dc.date.issued1989-11-01en_US
dc.identifier.citationSamanta, Shyam K.; Samajdar, S.; Durrant, W.; Gupta, M. (1989). "A novel processing technique for fabrication of flexible YBa2Cu3O7−x wire." Journal of Applied Physics 66(9): 4532-4534. <http://hdl.handle.net/2027.42/69429>en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/69429
dc.description.abstractA fabrication technique for producing flexible superconductor wire by extrusion of a composite of Ag2O‐YBa2 Cu3 O7−x is reported. During the course of processing, the superconductive transition of the starting powder is maintained, thus obviating the need for subsequent heat treatment. This nonpoisoning behavior of Ag2 O is of significant technical importance. Scanning electron fractography reveals a mixed mode fracture behavior of the material and the evidence of ductility. Magnetic measurements on the extruded wires show an onset temperature of 91 K. Resistivity measurements indicate that the electrical resistance of the as‐extruded wire essentially vanishes at liquid‐nitrogen temperature.en_US
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dc.publisherThe American Institute of Physicsen_US
dc.rights© The American Institute of Physicsen_US
dc.titleA novel processing technique for fabrication of flexible YBa2Cu3O7−x wireen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumPlasticity Laboratory, Department of Mechanical Engineering and Applied Mechanics, The University of Michigan, 2250 G. G. Brown, Ann Arbor, Michigan 48109en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/69429/2/JAPIAU-66-9-4532-1.pdf
dc.identifier.doi10.1063/1.343921en_US
dc.identifier.sourceJournal of Applied Physicsen_US
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dc.owningcollnamePhysics, Department of


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