Hot filament assisted deposition of silicon nitride thin films

Deshpande, Sadanand V.; Dupuie, Jeffrey L.; Gulari, Erdogan

Hot filament assisted deposition of silicon nitride thin films

dc.contributor.author	Deshpande, Sadanand V.	en_US
dc.contributor.author	Dupuie, Jeffrey L.	en_US
dc.contributor.author	Gulari, Erdogan	en_US
dc.date.accessioned	2010-05-06T20:41:25Z
dc.date.available	2010-05-06T20:41:25Z
dc.date.issued	1992-09-21	en_US
dc.identifier.citation	Deshpande, Sadanand V.; Dupuie, Jeffrey L.; Gulari, Erdogan (1992). "Hot filament assisted deposition of silicon nitride thin films." Applied Physics Letters 61(12): 1420-1422. <http://hdl.handle.net/2027.42/69495>	en_US
dc.identifier.uri	https://hdl.handle.net/2027.42/69495
dc.description.abstract	Hot filament assisted chemical vapor deposition (HFCVD) of silicon nitride thin films was studied with disilane (Si2H6) and ammonia (NH3) as the source gases. High optical density films were obtained at a low substrate temperature (375 °C) and high deposition rates (up to 1700 Å/min). The effects of disilane flow rate, filament temperature, and disilane carrier gas composition on film properties were investigated. Transmission infrared measurements showed low hydrogen content (<5%) in the films. Sputter depth profiling using x‐ray photoelectron spectroscopy indicated high film purity with only surface oxygen contamination from air exposure after deposition.	en_US
dc.format.extent	3102 bytes
dc.format.extent	371777 bytes
dc.format.mimetype	text/plain
dc.format.mimetype	application/pdf
dc.publisher	The American Institute of Physics	en_US
dc.rights	© The American Institute of Physics	en_US
dc.title	Hot filament assisted deposition of silicon nitride thin films	en_US
dc.type	Article	en_US
dc.subject.hlbsecondlevel	Physics	en_US
dc.subject.hlbtoplevel	Science	en_US
dc.description.peerreviewed	Peer Reviewed	en_US
dc.contributor.affiliationum	Department of Chemical Engineering, University of Michigan, Ann Arbor, Michigan 48105	en_US
dc.description.bitstreamurl	http://deepblue.lib.umich.edu/bitstream/2027.42/69495/2/APPLAB-61-12-1420-1.pdf
dc.identifier.doi	10.1063/1.107557	en_US
dc.identifier.source	Applied Physics Letters	en_US
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dc.owningcollname	Physics, Department of

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