Fabrication of elastomeric stamps with polymer-reinforced sidewalls via chemically selective vapor deposition polymerization of poly(p-xylylene)

Suh, Kahp Y.; Langer, Robert S.; Lahann, Jörg

Fabrication of elastomeric stamps with polymer-reinforced sidewalls via chemically selective vapor deposition polymerization of poly(p-xylylene)

dc.contributor.author	Suh, Kahp Y.	en_US
dc.contributor.author	Langer, Robert S.	en_US
dc.contributor.author	Lahann, Jörg	en_US
dc.date.accessioned	2010-05-06T21:14:28Z
dc.date.available	2010-05-06T21:14:28Z
dc.date.issued	2003-11-17	en_US
dc.identifier.citation	Suh, Kahp Y.; Langer, Robert; Lahann, Jörg (2003). "Fabrication of elastomeric stamps with polymer-reinforced sidewalls via chemically selective vapor deposition polymerization of poly(p-xylylene)." Applied Physics Letters 83(20): 4250-4252. <http://hdl.handle.net/2027.42/69846>	en_US
dc.identifier.uri	https://hdl.handle.net/2027.42/69846
dc.description.abstract	We report on the preparation of polydimethylsiloxane stamps with selectively grown polymer sidewalls by chemical vapor deposition polymerization of poly(ppoly(p-xylylene). Using a thin iron layer as an inhibitor, the deposition occurs only on the sidewalls of the features in relief, resulting in a polymer-reinforced stamp. The wetting properties of stamps can be restored after removing the thin iron layer with an acidic solution, which has been verified by pattern transfer to an underlying substrate using molding and microcontact printing. © 2003 American Institute of Physics.	en_US
dc.format.extent	3102 bytes
dc.format.extent	263695 bytes
dc.format.mimetype	text/plain
dc.format.mimetype	application/pdf
dc.publisher	The American Institute of Physics	en_US
dc.rights	© The American Institute of Physics	en_US
dc.title	Fabrication of elastomeric stamps with polymer-reinforced sidewalls via chemically selective vapor deposition polymerization of poly(p-xylylene)	en_US
dc.type	Article	en_US
dc.subject.hlbsecondlevel	Physics	en_US
dc.subject.hlbtoplevel	Science	en_US
dc.description.peerreviewed	Peer Reviewed	en_US
dc.contributor.affiliationum	Department of Chemical Engineering, University of Michigan, Ann Arbor, Michigan 48109	en_US
dc.contributor.affiliationother	Department of Chemical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139	en_US
dc.description.bitstreamurl	http://deepblue.lib.umich.edu/bitstream/2027.42/69846/2/APPLAB-83-20-4250-1.pdf
dc.identifier.doi	10.1063/1.1628392	en_US
dc.identifier.source	Applied Physics Letters	en_US
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dc.owningcollname	Physics, Department of

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