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Theoretical investigation of hole transport in strained III‐V semiconductors: Application to GaAs

dc.contributor.authorHinckley, John M.en_US
dc.contributor.authorSingh, J.en_US
dc.date.accessioned2010-05-06T21:28:32Z
dc.date.available2010-05-06T21:28:32Z
dc.date.issued1988-08-29en_US
dc.identifier.citationHinckley, J. M.; Singh, J. (1988). "Theoretical investigation of hole transport in strained III‐V semiconductors: Application to GaAs." Applied Physics Letters 53(9): 785-787. <http://hdl.handle.net/2027.42/69998>en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/69998
dc.description.abstractA Monte Carlo method has been developed and applied to study the anisotropic transport of holes in unstrained and strained bulk III‐V compound semiconductors. In this letter, we present the results for the prototypical GaAs, T=300 K material system. We find that the hole mobility can be significantly increased by the presence of biaxial compressive strain in the system. This arises from strain‐induced modifications in the densities of states and the overlap functions and from a separation of the heavy and light hole bands at k=0 which decreases the heavy to light hole interband scattering. For a 1.5% biaxial compressive strain, the hole mobilities are increased by up to a factor of 2 over the unstrained values. This improvement is sustained up to the highest field in our simulations which was 20 kV/cm.en_US
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dc.publisherThe American Institute of Physicsen_US
dc.rights© The American Institute of Physicsen_US
dc.titleTheoretical investigation of hole transport in strained III‐V semiconductors: Application to GaAsen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumCenter for High Frequency Microelectronics, Department of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, Michigan 48109‐2122en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/69998/2/APPLAB-53-9-785-1.pdf
dc.identifier.doi10.1063/1.99833en_US
dc.identifier.sourceApplied Physics Lettersen_US
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dc.owningcollnamePhysics, Department of


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