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Mechanisms of nitrogen incorporation in GaAsNGaAsN alloys

dc.contributor.authorReason, M.en_US
dc.contributor.authorMcKay, H. A.en_US
dc.contributor.authorYe, W.en_US
dc.contributor.authorHanson, S.en_US
dc.contributor.authorGoldman, R. S.en_US
dc.contributor.authorRotberg, V. H. (Victor H.)en_US
dc.date.accessioned2010-05-06T21:32:58Z
dc.date.available2010-05-06T21:32:58Z
dc.date.issued2004-09-06en_US
dc.identifier.citationReason, M.; McKay, H. A.; Ye, W.; Hanson, S.; Goldman, R. S.; Rotberg, V. (2004). "Mechanisms of nitrogen incorporation in GaAsNGaAsN alloys." Applied Physics Letters 85(10): 1692-1694. <http://hdl.handle.net/2027.42/70046>en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/70046
dc.description.abstractWe have investigated nitrogen incorporation mechanisms in dilute nitride GaAsNGaAsN alloys grown by plasma-assisted molecular-beam epitaxy. A comparison of nuclear reaction analysis and Rutherford backscattering spectrometry in channeling and nonchanneling conditions reveals significant composition-dependent incorporation of NN into nonsubstitutional sites, presumably as either N–NN–N or N–AsN–As split interstitials. Furthermore, we identify the (2×1)(2×1) reconstruction as the surface structure which leads to the highest substitutional NN incorporation, likely due to the high number of group VV sites per unit area available for N–AsN–As surface exchange.en_US
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dc.publisherThe American Institute of Physicsen_US
dc.rights© The American Institute of Physicsen_US
dc.titleMechanisms of nitrogen incorporation in GaAsNGaAsN alloysen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109-2136en_US
dc.contributor.affiliationumDepartment of Nuclear Engineering and Radiological Sciences, University of Michigan, Ann Arbor, Michigan 48109-2145en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/70046/2/APPLAB-85-10-1692-1.pdf
dc.identifier.doi10.1063/1.1789237en_US
dc.identifier.sourceApplied Physics Lettersen_US
dc.identifier.citedreferenceM. Weyers, M. Sato, and H. Ando, Jpn. J. Appl. Phys., Part 1JAPNDE 31, 853 (1992).en_US
dc.identifier.citedreferenceW. G. Bi and C. W. Tu, Appl. Phys. Lett.APPLAB 70, 1608 (1997).en_US
dc.identifier.citedreferenceL. Bellaiche, S.-H. Wei, and A. Zunger, Phys. Rev. BPRBMDO 54, 17568 (1996).en_US
dc.identifier.citedreferenceR. Mouillet, L.-A. de Vaulchier, E. Deleporte, Y. Guldner, L. Travers, and J.-C. Harmand, Solid State Commun.SSCOA4 126, 333 (2003).en_US
dc.identifier.citedreferenceJ. S. Wang, A. R. Kovsh, L. Wei, J. Y. Chi, Y. T. Wu, P. Y. Wang, and V. M. Ustinov, NanotechnologyNNOTER 12, 430 (2001).en_US
dc.identifier.citedreferenceI. A. Buyanova, W. M. Chen, and C. W. Tu, Semicond. Sci. Technol.SSTEET 17, 815 (2002).en_US
dc.identifier.citedreferenceT. Ahlgren, E. Vainonen-Ahlgren, J. Likonen, W. Li, and M. Pessa, Appl. Phys. Lett.APPLAB 80, 2314 (2002).en_US
dc.identifier.citedreferenceG. Bisognin, D. De Salvador, C. Mattevi, M. Berti, A. V. Drigo, G. Ciatto, L. Grenouillet, P. Duvaut, P. Gilet, and H. Mariette, J. Appl. Phys.JAPIAU 95, 48 (2004).en_US
dc.identifier.citedreferenceS. B. Zhang and S.-H. Wei, Phys. Rev. Lett.PRLTAO 86, 1789 (2001).en_US
dc.identifier.citedreferenceS. G. Spruytte, M. C. Larson, W. Wampler, C. W. Coldren, H. E. Petersen, and J. S. Harris, J. Cryst. GrowthJCRGAE 227-228, 506 (2001).en_US
dc.identifier.citedreferenceH. C. Alt, A. Y. Egorov, H. Riechert, J. D. Meyer, and B. Wiedemann, Physica BPHYBE3 308-310, 877 (2001).en_US
dc.identifier.citedreferenceH. Shtrikman (private communication).en_US
dc.identifier.citedreferenceD. W. Gotthold, S. Govindaraju, T. Mattord, A. L. Holmes, Jr., and B. G. Streetman, J. Vac. Sci. Technol. AJVTAD6 18, 461 (2000).en_US
dc.identifier.citedreferenceB. D. Schultz, H. H. Farrell, M. M. R. Evans, K. Ludge, and C. J. Palmstrom, J. Vac. Sci. Technol. BJVTBD9 20, 1600 (2002).en_US
dc.identifier.citedreferenceM.-A. Pinault and E. Tournie, Appl. Phys. Lett.APPLAB 79, 3404 (2001).en_US
dc.identifier.citedreferenceA. R. Kovsh, J. S. Wang, L. Wei, R. S. Shiao, J. Y. Chi, B. V. Volovik, A. F. Tsatsul’nikov, and V. M. Ustinov, J. Vac. Sci. Technol. BJVTBD9 20, 1158 (2002).en_US
dc.identifier.citedreferenceS. Z. Wang, S. F. Yoon, and W. K. Loke, J. Appl. Phys.JAPIAU 94, 2662 (2003).en_US
dc.identifier.citedreferenceTRIM code, available at www.srim.org.en_US
dc.identifier.citedreferenceG. Amsel, J. P. Nadai, E. d’Artemare, D. David, E. Girard, and J. Moulin, Nucl. Instrum. MethodsNUIMAL 92, 481 (1971).en_US
dc.identifier.citedreferenceR. A. Stall, C. E. C. Wood, P. D. Kirchner, and L. F. Eastman, Electron. Lett.ELLEAK 16, 171 (1980).en_US
dc.identifier.citedreferenceH. A. McKay, R. M. Feenstra, T. Schmidtling, and U. W. Pohl, Appl. Phys. Lett.APPLAB 78, 82 (2001).en_US
dc.identifier.citedreferenceY.-C. Chang and D. E. Aspnes, Phys. Rev. BPRBMDO 41, 12002 (1990).en_US
dc.identifier.citedreferenceH. H. Farrell, M. C. Tamargo, J. L. de Miguel, F. S. Turco, D. M. Hwang, and R. E. Nahory, J. Appl. Phys.JAPIAU 69, 7021 (1991).en_US
dc.identifier.citedreferenceW. G. Schmidt, Appl. Phys. A: Mater. Sci. Process.APAMFC 75, 89 (2002).en_US
dc.identifier.citedreferenceR. J. Hauenstein, D. A. Collins, X. P. Cai, M. L. O’Steen, and T. C. McGill, Appl. Phys. Lett.APPLAB 66, 2861 (1995).en_US
dc.identifier.citedreferenceC. Calmes, D. Bouchier, D. Debarre, V. Le Thanh, and C. Clerc, Thin Solid FilmsTHSFAP 428, 150 (2003).en_US
dc.identifier.citedreferenceP. Krispin, V. Gambin, J. S. Harris, and K. H. Ploog, J. Appl. Phys.JAPIAU 93, 6095 (2003).en_US
dc.owningcollnamePhysics, Department of


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