Local crystallographic texture and voiding in passivated copper interconnects
dc.contributor.author | Nucci, J. A. | en_US |
dc.contributor.author | Keller, R. R. | en_US |
dc.contributor.author | Sanchez, John E. | en_US |
dc.contributor.author | Shacham‐diamand, Y. | en_US |
dc.date.accessioned | 2010-05-06T21:58:31Z | |
dc.date.available | 2010-05-06T21:58:31Z | |
dc.date.issued | 1996-12-23 | en_US |
dc.identifier.citation | Nucci, J. A.; Keller, R. R.; Sanchez, J. E.; Shacham‐Diamand, Y. (1996). "Local crystallographic texture and voiding in passivated copper interconnects." Applied Physics Letters 69(26): 4017-4019. <http://hdl.handle.net/2027.42/70319> | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/70319 | |
dc.description.abstract | A correlation between local crystallographic texture and stress‐induced void formation in tantalum‐encapsulated, copper interconnects was revealed by electron backscattering diffraction studies in a scanning electron microscope. Lines exhibiting an overall stronger 〈111〉 texture showed better resistance to void formation. Furthermore, grains adjacent to voids exhibited weaker 〈111〉 texture than grains in unvoided regions of the same line. The locally weaker 〈111〉 texture at voided locations suggests the presence of higher diffusivity, twist boundaries. This work, which represents the first characterization of local texture in stress voided, copper lines, helps to elucidate the relative importance of the thermodynamic and kinetic factors which govern void formation and growth. © 1996 American Institute of Physics. | en_US |
dc.format.extent | 3102 bytes | |
dc.format.extent | 49954 bytes | |
dc.format.mimetype | text/plain | |
dc.format.mimetype | application/pdf | |
dc.publisher | The American Institute of Physics | en_US |
dc.rights | © The American Institute of Physics | en_US |
dc.title | Local crystallographic texture and voiding in passivated copper interconnects | en_US |
dc.type | Article | en_US |
dc.subject.hlbsecondlevel | Physics | en_US |
dc.subject.hlbtoplevel | Science | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | Department of Materials Science and Engineering, 2122 Dow Building, University of Michigan, Ann Arbor, Michigan 48109 | en_US |
dc.contributor.affiliationother | School of Electrical Engineering, Phillips Hall, Cornell University, Ithaca, New York 14853 | en_US |
dc.contributor.affiliationother | National Institute of Standards and Technology, Materials Reliability Division, Boulder, Colorado 80303 | en_US |
dc.contributor.affiliationother | School of Electrical Engineering, Phillips Hall, Cornell University, Ithaca, New York 14853 | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/70319/2/APPLAB-69-26-4017-1.pdf | |
dc.identifier.doi | 10.1063/1.117856 | en_US |
dc.identifier.source | Applied Physics Letters | en_US |
dc.owningcollname | Physics, Department of |
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