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Investigation of reactive‐ion‐etch‐induced damage of InP/InGaAs multiple quantum wells by photoluminescence

dc.contributor.authorSteffensen, O. M.en_US
dc.contributor.authorBirkedal, D.en_US
dc.contributor.authorHanberg, J.en_US
dc.contributor.authorAlbrektsen, O.en_US
dc.contributor.authorPang, S. W.en_US
dc.date.accessioned2010-05-06T22:06:22Z
dc.date.available2010-05-06T22:06:22Z
dc.date.issued1995-08-01en_US
dc.identifier.citationSteffensen, O. M.; Birkedal, D.; Hanberg, J.; Albrektsen, O.; Pang, S. W. (1995). "Investigation of reactive‐ion‐etch‐induced damage of InP/InGaAs multiple quantum wells by photoluminescence." Journal of Applied Physics 78(3): 1528-1532. <http://hdl.handle.net/2027.42/70403>en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/70403
dc.description.abstractThe effects of CH4/H2 reactive ion etching (RIE) on the optical properties of an InP/InGaAs multiple‐quantum‐well structure have been investigated by low‐temperature photoluminescence (PL). The structure consisted of eight InGaAs quantum wells, lattice matched to InP, with nominal thicknesses of 0.5, 1, 2, 3, 5, 10, 20, and 70 monolayers, respectively, on top of a 200‐nm‐thick layer of InGaAs for calibration. The design of this structure allowed etch‐induced damage depth to be obtained from the PL spectra due to the different confinement energies of the quantum wells. The samples showed no significant decrease of luminescence intensity after RIE. However, the observed shift and broadening of the PL peaks from the quantum wells indicate that intermixing of well and barrier material increased with etch time. © 1995 American Institute of Physics.en_US
dc.format.extent3102 bytes
dc.format.extent640091 bytes
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dc.format.mimetypeapplication/pdf
dc.publisherThe American Institute of Physicsen_US
dc.rights© The American Institute of Physicsen_US
dc.titleInvestigation of reactive‐ion‐etch‐induced damage of InP/InGaAs multiple quantum wells by photoluminescenceen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumUniversity of Michigan, Department of Electrical Engineering and Computer Science, Ann Arbor, Michigan 48109‐2122en_US
dc.contributor.affiliationotherMikroelektronik Centret, Building 345 East, Technical University of Denmark, DK‐2800 Lyngby, Denmarken_US
dc.contributor.affiliationotherTele Danmark Research, Lyngsø Allé 2, DK‐2970 Hørsholm, Denmarken_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/70403/2/JAPIAU-78-3-1528-1.pdf
dc.identifier.doi10.1063/1.360245en_US
dc.identifier.sourceJournal of Applied Physicsen_US
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dc.owningcollnamePhysics, Department of


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