Show simple item record

Low energy kinetic threshold in the growth of cubic boron nitride films

dc.contributor.authorKidner, S.en_US
dc.contributor.authorTaylor, C. A.en_US
dc.contributor.authorClarke, Royen_US
dc.date.accessioned2010-05-06T22:16:23Z
dc.date.available2010-05-06T22:16:23Z
dc.date.issued1994-04-04en_US
dc.identifier.citationKidner, S.; Taylor, C. A.; Clarke, Roy (1994). "Low energy kinetic threshold in the growth of cubic boron nitride films." Applied Physics Letters 64(14): 1859-1861. <http://hdl.handle.net/2027.42/70509>en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/70509
dc.description.abstractWe report the growth of cubic boron nitride (cBN) films by magnetron sputtering on Si (100) substrates. The films are grown in the presence of negative substrate bias voltages and a nitrogen plasma produced by an electron cyclotron resonance source. We find evidence for a sharp low‐voltage threshold in the substrate bias (−105 V) beyond which the samples are predominantly cBN. The structural quality of the cBN films is optimized in a narrow range of voltages near this threshold. We discuss the important role of energetic ions in the formation of cBN in light of recent theoretical findings.en_US
dc.format.extent3102 bytes
dc.format.extent374047 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.publisherThe American Institute of Physicsen_US
dc.rights© The American Institute of Physicsen_US
dc.titleLow energy kinetic threshold in the growth of cubic boron nitride filmsen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumHarrison M. Randall Laboratory of Physics, University of Michigan, Ann Arbor, Michigan 48109‐1120en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/70509/2/APPLAB-64-14-1859-1.pdf
dc.identifier.doi10.1063/1.111779en_US
dc.identifier.sourceApplied Physics Lettersen_US
dc.identifier.citedreferenceR. H. Wentorf, J. Chem. Phys. 26, 956 (1957).en_US
dc.identifier.citedreferenceR. F. Davis, Proc. IEEE 79, 702 (1991).en_US
dc.identifier.citedreferenceS. Strife and H. Morkoç, J. Vac. Sci. Technol. B 10, 1237 (1992).en_US
dc.identifier.citedreferenceM. Mieno, T. Yoshida, and K. Akashi, J. Jpn. Inst. Metals 52, 199 (1988).en_US
dc.identifier.citedreferenceM. Mieno and T. Yoshida, Surf. Coatings Technol. 52, 87 (1992).en_US
dc.identifier.citedreferenceT. Wada and N. Yamashita, J. Vac. Sci. Technol. A 10, 515 (1992).en_US
dc.identifier.citedreferenceN. Tanabe, T. Hayashi, and M. Iwaki, Diamond and Related Materials, 1, 883 (1992).en_US
dc.identifier.citedreferenceA. K. Ballal, L. Salamanca-Riba, G. L. Doll, C. A. Taylor, and R. Clarke, J. Mater. Res. 7, 1618 (1992).en_US
dc.identifier.citedreferenceD. J. Kester, K. S. Ailey, R. F. Davis, and K. L. More, J. Mater. Res. 8, 1213 (1993).en_US
dc.identifier.citedreferenceA. Weber et al., J. Phys. III (Paris) 2, 1931 (1992).en_US
dc.identifier.citedreferenceA. Ishizaka and Y. Shiraki, J. Electrochem. Soc. 133, 666 (1986).en_US
dc.identifier.citedreferenceD. Kester and R. Messier, Mater. Res. Soc. Symp. Proc. 35, 721 (1992); J. Appl. Phys. 72, 504 (1992).en_US
dc.identifier.citedreferenceW. Wu and S. Fahy, Phys. Rev. B (in press).en_US
dc.identifier.citedreferenceThe 100 eV100eV energy range assumes that the incident ion will recoil from the lattice upon collision, transferring approximately 50% of its kinetic energy.en_US
dc.identifier.citedreferenceC. D. Clark and E. W. J. Mitchell, Institute of Physics Conference Series (Institute of Physics, London, 1977), p. 45.en_US
dc.owningcollnamePhysics, Department of


Files in this item

Show simple item record

Remediation of Harmful Language

The University of Michigan Library aims to describe library materials in a way that respects the people and communities who create, use, and are represented in our collections. Report harmful or offensive language in catalog records, finding aids, or elsewhere in our collections anonymously through our metadata feedback form. More information at Remediation of Harmful Language.

Accessibility

If you are unable to use this file in its current format, please select the Contact Us link and we can modify it to make it more accessible to you.