Show simple item record

Magnetic field effect on the sheath thickness in plasma immersion ion implantation

dc.contributor.authorKeidar, Michaelen_US
dc.contributor.authorMonteiro, O. R.en_US
dc.contributor.authorAnders, A.en_US
dc.contributor.authorBoyd, Iain D.en_US
dc.date.accessioned2010-05-06T22:22:42Z
dc.date.available2010-05-06T22:22:42Z
dc.date.issued2002-08-12en_US
dc.identifier.citationKeidar, M.; Monteiro, O. R.; Anders, A.; Boyd, I. D. (2002). "Magnetic field effect on the sheath thickness in plasma immersion ion implantation." Applied Physics Letters 81(7): 1183-1185. <http://hdl.handle.net/2027.42/70576>en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/70576
dc.description.abstractThe sheath thickness in plasma immersion ion implantation has been investigated in the presence of a transverse magnetic field. It has been found that the steady-state sheath thickness increases with increasing magnetic field strength. This result is in line with a simplified model of the sheath in which the steady-state sheath thickness is determined by the plasma density and ion velocity at the sheath edge. These results suggest that a magnetic field may be used to control the high-voltage sheath in plasma immersion ion implantation. © 2002 American Institute of Physics.en_US
dc.format.extent3102 bytes
dc.format.extent50280 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.publisherThe American Institute of Physicsen_US
dc.rights© The American Institute of Physicsen_US
dc.titleMagnetic field effect on the sheath thickness in plasma immersion ion implantationen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Aerospace Engineering, The University of Michigan, Ann Arbor, Michigan 48109en_US
dc.contributor.affiliationumDepartment of Aerospace Engineering, The University of Michigan, Ann Arbor, Michigan 48109en_US
dc.contributor.affiliationotherLawrence Berkeley National Laboratory, MS 53, University of California, Berkeley, California 94720en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/70576/2/APPLAB-81-7-1183-1.pdf
dc.identifier.doi10.1063/1.1499516en_US
dc.identifier.sourceApplied Physics Lettersen_US
dc.identifier.citedreferenceJ. R. Conrad, J. L. Radtke, R. A. Dodd, F. J. Worzala, and N. C. Tran, J. Appl. Phys. JAPIAU62, 4591 (1987).en_US
dc.identifier.citedreferenceHandbook of Plasma Immersion Ion Implantation and Deposition, edited by A. Anders (Wiley, New York, 2000).en_US
dc.identifier.citedreferenceI. G. Brown, X. Godechot, and K. M. Yu, Appl. Phys. Lett. APPLAB58, 1392 (1991).en_US
dc.identifier.citedreferenceI. G. Brown, A. Anders, S. Anders, M. R. Dickinson, I. C. Ivanov, R. A. MacGill, X. Yao, and K. M. Yu, Nucl. Instrum. Methods Phys. Res. B NIMBEU80/81, 1281 (1993).en_US
dc.identifier.citedreferenceA. Anders, Surf. Coat. Technol. SCTEEJ93, 157 (1997).en_US
dc.identifier.citedreferenceI. G. Brown, Surf. Coat. Technol. SCTEEJ136, 16 (2000).en_US
dc.identifier.citedreferenceA. Anders, Surf. Coat. Technol. SCTEEJ136, 85 (2001).en_US
dc.identifier.citedreferenceM. A. Lieberman, J. Appl. Phys. JAPIAU66, 2926 (1989).en_US
dc.identifier.citedreferenceI. G. Brown, O. Monteiro, and M. M. M. Bilek, Appl. Phys. Lett. APPLAB74, 2426 (1999).en_US
dc.identifier.citedreferenceM. Keidar and I. G. Brown, J. Vac. Sci. Technol. B JVTBD917, 2648 (1999).en_US
dc.identifier.citedreferenceM. Keidar, O. Monteiro, and I. G. Brown, Appl. Phys. Lett. APPLAB76, 3002 (2000).en_US
dc.identifier.citedreferenceA. Anders, Appl. Phys. Lett. APPLAB76, 28 (2000).en_US
dc.identifier.citedreferenceM. M. M. Bilek, J. Appl. Phys. JAPIAU89, 923 (2001).en_US
dc.identifier.citedreferenceM. Keidar and I. I. Beilis, Appl. Phys. Lett. APPLAB73, 306 (1998).en_US
dc.identifier.citedreferenceD. J. Rej, B. P. Wood, R. J. Faehl, and H. H. Fleischmann, J. Vac. Sci. Technol. B JVTBD912, 861 (1994).en_US
dc.identifier.citedreferenceM. Shamim, J. T. Scheuer, and J. R. Conrad, J. Appl. Phys. JAPIAU69, 2904 (1991).en_US
dc.identifier.citedreferenceC. D. Child, Phys. Rev. PHRVAO32, 492 (1911).en_US
dc.identifier.citedreferenceI. Langmuir, Phys. Rev. PHRVAO2, 450 (1913).en_US
dc.identifier.citedreferenceG. Yushkov, A. Anders, E. M. Oks, and I. G. Brown, J. Appl. Phys. JAPIAU88, 5618 (2000).en_US
dc.identifier.citedreferenceB. Jüttner, IEEE Trans. Plasma Sci. ITPSBDPS-15, 474 (1987).en_US
dc.identifier.citedreferenceM. Keidar, I. Beilis, R. L. Boxman, and S. Goldsmith, J. Phys. D JPAPBE29, 1973 (1996).en_US
dc.identifier.citedreferenceD. A. Baker and J. E. Hammer, Phys. Rev. Lett. PRLTAO8, 157 (1962).en_US
dc.identifier.citedreferenceO. Buneman, IEEE Trans. Plasma Sci. ITPSBD20, 672 (1992).en_US
dc.identifier.citedreferenceM. Keidar and I. D. Boyd, J. Appl. Phys. JAPIAU86, 4786 (1999).en_US
dc.owningcollnamePhysics, Department of


Files in this item

Show simple item record

Remediation of Harmful Language

The University of Michigan Library aims to describe library materials in a way that respects the people and communities who create, use, and are represented in our collections. Report harmful or offensive language in catalog records, finding aids, or elsewhere in our collections anonymously through our metadata feedback form. More information at Remediation of Harmful Language.

Accessibility

If you are unable to use this file in its current format, please select the Contact Us link and we can modify it to make it more accessible to you.