Show simple item record

Mechanism of texture development in ion-beam-assisted deposition

dc.contributor.authorDong, Liangen_US
dc.contributor.authorSrolovitz, David J.en_US
dc.date.accessioned2010-05-06T22:43:58Z
dc.date.available2010-05-06T22:43:58Z
dc.date.issued1999-07-26en_US
dc.identifier.citationDong, L.; Srolovitz, D. J. (1999). "Mechanism of texture development in ion-beam-assisted deposition." Applied Physics Letters 75(4): 584-586. <http://hdl.handle.net/2027.42/70800>en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/70800
dc.description.abstractWe perform a series of atomistic simulations of ion-beam-assisted deposition (IBAD) to identify the mechanism by which ion beams select crystallographic texture. Simulations were devised to distinguish between two previously proposed mechanisms: (1) preferential sputtering of differently oriented grains and (2) preferential damage of differently oriented grains followed by grain-boundary migration. We show that while preferential sputtering is capable of producing texture change, it does so much more slowly than observed in IBAD. Simulations that include only differential damage produce structures which are nearly indistinguishable from those seen in IBAD. These results conclusively demonstrate that texture evolution during ion-beam-assisted deposition is dominated by differential damage and subsequent recrystallization.© 1999 American Institute of Physics.en_US
dc.format.extent3102 bytes
dc.format.extent627682 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.publisherThe American Institute of Physicsen_US
dc.rights© The American Institute of Physicsen_US
dc.titleMechanism of texture development in ion-beam-assisted depositionen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Materials Science and Engineering, The University of Michigan, Ann Arbor, Michigan 48109-2136en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/70800/2/APPLAB-75-4-584-1.pdf
dc.identifier.doi10.1063/1.124449en_US
dc.identifier.sourceApplied Physics Lettersen_US
dc.identifier.citedreferenceG. N. Van Wyk and H. J. Smith, Nucl. Instrum. Methods NUIMAL170, 443 (1980).en_US
dc.identifier.citedreferenceD. Dobrev, Thin Solid Films THSFAP92, 41 (1982).en_US
dc.identifier.citedreferenceL. S. Yu, J. M. E. Harper, J. J. Cuomo, and D. A. Smith, Appl. Phys. Lett. APPLAB47, 932 (1985).en_US
dc.identifier.citedreferenceL. S. Yu, J. M. E. Harper, J. J. Cuomo, and D. A. Smith, J. Vac. Sci. Technol. A JVTAD64, 443 (1986).en_US
dc.identifier.citedreferenceW. Ensinger, Nucl. Instrum. Methods Phys. Res. B NIMBEU106, 142 (1995).en_US
dc.identifier.citedreferenceY. Nagai, A. Tago, and T. Toshima, J. Vac. Sci. Technol. A JVTAD65, 61 (1987).en_US
dc.identifier.citedreferenceG. Was, D. J. Srolovitz, Z. Ma, and L. Dong, Mater. Res. Soc. Symp. Proc. MRSPDH441, 311 (1997).en_US
dc.identifier.citedreferenceF. A. Smidt, Int. Mater. Rev. INMREO35, 61 (1990).en_US
dc.identifier.citedreferenceR. M. Bradley, J. M. E. Harper, and D. A. Smith, J. Appl. Phys. JAPIAU60, 4160 (1986).en_US
dc.identifier.citedreferenceR. M. Bradley, J. M. E. Harper, and D. A. Smith, J. Vac. Sci. Technol. A JVTAD65, 1792 (1987).en_US
dc.identifier.citedreferenceH. E. Roosendaal, in Topics in Applied Physics, edited by R. Behrisch (Springer, Berlin, 1981), Vol. 47, Chap. 5.en_US
dc.identifier.citedreferenceL. Dong and D. J. Srolovitz, J. Appl. Phys. JAPIAU84, 5261 (1998).en_US
dc.identifier.citedreferenceG. Molière, Z. Naturforsch. A ZENAAU2A, 133 (1947).en_US
dc.identifier.citedreferenceF. Ying, R. W. Smith, and D. J. Srolovitz, Appl. Phys. Lett. APPLAB61, 3007 (1996).en_US
dc.owningcollnamePhysics, Department of


Files in this item

Show simple item record

Remediation of Harmful Language

The University of Michigan Library aims to describe library materials in a way that respects the people and communities who create, use, and are represented in our collections. Report harmful or offensive language in catalog records, finding aids, or elsewhere in our collections anonymously through our metadata feedback form. More information at Remediation of Harmful Language.

Accessibility

If you are unable to use this file in its current format, please select the Contact Us link and we can modify it to make it more accessible to you.