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DeviceNet reliability assessment using physical and data link layer parameters

dc.contributor.authorLei, Yongen_US
dc.contributor.authorDjurdjanovic, Draganen_US
dc.contributor.authorNi, Junen_US
dc.date.accessioned2010-11-03T15:22:35Z
dc.date.available2011-03-01T16:26:41Zen_US
dc.date.issued2010-11en_US
dc.identifier.citationLei, Yong; Djurdjanovic, Dragan; Ni, Jun (2010). "DeviceNet reliability assessment using physical and data link layer parameters." Quality and Reliability Engineering International 26(7): 703-715. <http://hdl.handle.net/2027.42/78241>en_US
dc.identifier.issn0748-8017en_US
dc.identifier.issn1099-1638en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/78241
dc.description.abstractSince the 1990s, the increasing deployments of networked automation systems led to increased manufacturing productivity, improved interchangeability of devices from different vendors, facilitated flexibility and reconfigurability for various applications and improved reliability, while reducing installation and maintenance costs. However, the reliability of a network has great impact on the reliability of a networked automation system. This paper presents a novel network reliability assessment method that provides diagnostic and prognostic information for DeviceNet. This work proposes a hybrid network error analysis method using combined physical and datalink layer features to provide complete communication log information. Furthermore, a network/node time to failure (bus-off) prediction algorithm was developed based on the analysis of the patterns of the interrupted packets on the network. The method developed in this study can be used for network reliability evaluation and diagnosis, facilitating better network maintenance decision making. A laboratory testbed was constructed and the experiments on network and node time to failure were conducted to demonstrate the concept. Experimental results show that the proposed method can fully reconstruct the communication log, and predict the network/node bus-off time successfully. Copyright © 2010 John Wiley & Sons, Ltd.en_US
dc.format.extent422289 bytes
dc.format.extent3118 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.publisherJohn Wiley & Sons, Ltd.en_US
dc.subject.otherEngineeringen_US
dc.subject.otherElectronic, Electrical & Telecommunications Engineeringen_US
dc.titleDeviceNet reliability assessment using physical and data link layer parametersen_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelManagementen_US
dc.subject.hlbsecondlevelMathematicsen_US
dc.subject.hlbsecondlevelEconomicsen_US
dc.subject.hlbtoplevelBusinessen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Mechanical Engineering, University of Michigan, Ann Arbor, U.S.A.en_US
dc.contributor.affiliationotherThe State Key Laboratory of Fluid Power Transmission and Control, Zhejiang University, Hangzhou, People's Republic of China ; The State Key Laboratory of Fluid Power Transmission and Control, Zhejiang University, Hangzhou, People's Republic of Chinaen_US
dc.contributor.affiliationotherDepartment of Mechanical Engineering, University of Texas, Austin, U.S.A.en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/78241/1/1131_ftp.pdf
dc.identifier.doi10.1002/qre.1131en_US
dc.identifier.sourceQuality and Reliability Engineering Internationalen_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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