Effect of Nanoscale Heating on Electrical Transport in RF MEMS Switch Contacts
dc.contributor.author | Jensen, Brian D. | en_US |
dc.contributor.author | Chow, Linda L. W. | en_US |
dc.contributor.author | Huang, Kuangwei | en_US |
dc.contributor.author | Saitou, Kazuhiro | en_US |
dc.contributor.author | Volakis, John Leonidas | en_US |
dc.contributor.author | Kurabayashi, Katsuo | en_US |
dc.date.accessioned | 2011-11-14T16:31:08Z | |
dc.date.available | 2011-11-14T16:31:08Z | |
dc.date.issued | 2005-10-10 | en_US |
dc.identifier.citation | Jensen, B. D.; Chow, L. L.-W.; Huang, K.; Saitou, K.; Volakis, J. L.; Kurabayashi, K. (2005). Effect of Nanoscale Heating on Electrical Transport in RF MEMS Switch Contacts." IEEE/ASME Journal of Microelectromechanical Systems 14(5): 935-946. <http://hdl.handle.net/2027.42/87261> | en_US |
dc.identifier.issn | 1057-7157 | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/87261 | |
dc.description.abstract | This paper explores contact heating in microelectromechanical systems (MEMS) switches with contact spot sizes less than 100 nm in diameter. Experiments are conducted to demonstrate that contact heating causes a drop in contact resistance. However, existing theory is shown to over-predict heating for MEMS switch contacts because it does not consider ballistic transport of electrons in the contact. Therefore, we extend the theory and develop a predictive model that shows excellent agreement with the experimental results. It is also observed that mechanical cycling causes an increase in contact resistance. We identify this effect as related to the build-up of an insulating film and demonstrate operational conditions to prevent an increase in contact resistance. The improved understanding of contact behavior gained through our modeling and experiments allows switch performance to be improved. | en_US |
dc.publisher | IEEE | en_US |
dc.title | Effect of Nanoscale Heating on Electrical Transport in RF MEMS Switch Contacts | en_US |
dc.type | Article | en_US |
dc.subject.hlbsecondlevel | Mechanical Engineering | en_US |
dc.subject.hlbtoplevel | Engineering | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | Department of Mechanical Engineering | en_US |
dc.contributor.affiliationother | The Department of Mechanical Engineering, Brigham Young University, Provo, UT 84602 USA. the Department of Electrical and Computer Engineering, The Ohio State University, Columbus, OH 43212 USA. | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/87261/4/Saitou21.pdf | |
dc.identifier.doi | 10.1109/JMEMS.2005.856653 | en_US |
dc.identifier.source | Journal of Microelectromechanical Systems | en_US |
dc.owningcollname | Mechanical Engineering, Department of |
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