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Force Dependence of RF MEMS Switch Contact Heating

dc.contributor.authorJensen, Brian D.en_US
dc.contributor.authorChow L.en_US
dc.contributor.authorWebbink R.en_US
dc.contributor.authorSaitou, Kazuhiroen_US
dc.contributor.authorVolakis J.en_US
dc.contributor.authorKurabayashi, Katsuoen_US
dc.date.accessioned2011-11-14T16:31:11Z
dc.date.available2011-11-14T16:31:11Z
dc.date.issued2004-01-25en_US
dc.identifier.citationJensen, B.; Chow L.; Webbink R.; Saitou, K.; Volakis J.; Kurabayashi, K. (2004). Force Dependence of RF MEMS Switch Contact Heating." Proceedings of IEEE International Conference on Micro Electro Mechanical Systems: 137-140. <http://hdl.handle.net/2027.42/87263>en_US
dc.identifier.isbn0-7803-8265-Xen_US
dc.identifier.urihttps://hdl.handle.net/2027.42/87263
dc.description.abstractContact-type RF MEMS switches have demonstrated low on-state resistance, high off-state impedance, and very large bandwidth; however, their power handling capability is low due to failure caused by contact heating. This paper examines contact heating by measuring V-I curves for contacts in gold switches. Multiphysics modeling allows extraction of contact temperature. Contacts are found to soften and self-anneal at a temperature of about 100¡C, corresponding to a contact voltage of about 80 mV. Larger contact force induces a larger decrease in contact resistance during softening, suppressing contact heating. The data provide a better understanding of micro-scale contact physics, leading to design for switches for improved power-handling capability.en_US
dc.publisherIEEEen_US
dc.titleForce Dependence of RF MEMS Switch Contact Heatingen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelMechanical Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Mechanical Engineeringen_US
dc.contributor.affiliationotherDepartment of Electrical Engineering, Ohio State University Columbus, Ohio, 43210, USA.en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/87263/4/Saitou88.pdf
dc.identifier.doi10.1109/MEMS.2004.1290541en_US
dc.identifier.sourceProceedings of IEEE International Conference on Micro Electro Mechanical Systemsen_US
dc.owningcollnameMechanical Engineering, Department of


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