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Fully Integrated Electrothermal Multi-Domain Modeling of RF MEMS Switches

dc.contributor.authorJensen, Brian D.en_US
dc.contributor.authorSaitou, Kazuhiroen_US
dc.contributor.authorVolakis, John Leonidasen_US
dc.contributor.authorKurabayashi, Katsuoen_US
dc.date.accessioned2011-11-14T16:31:12Z
dc.date.available2011-11-14T16:31:12Z
dc.date.issued2003-09-23en_US
dc.identifier.citationJensen, B. D.; Saitou, K.; Volakis, J.; Kurabayashi, K. (2003). Fully Integrated Electrothermal Multi-Domain Modeling of RF MEMS Switches." IEEE Microwave and Wireless Components Letters 13(9): 364-366. <http://hdl.handle.net/2027.42/87264>en_US
dc.identifier.issn1531-1309en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/87264
dc.description.abstractRF MEMS switches have demonstrated excellent performance. However, before such switches can be fully implemented, they must demonstrate high reliability and robust power-handling capability. Numerical simulation is a vital part of design to meet these goals. This paper demonstrates a fully integrated electrothermal model of an RF MEMS switch which solves for RF current and switch temperature. The results show that the beam temperature increases with either higher input power or increased frequency. The simulation data are used to predict switch failure due to temperature-related creep and self pull-in over a wide range of operating frequency (0.1-40 GHz) and power input (0-10 W). Self pull-in is found to be the dominant failure mechanism for an example geometry.en_US
dc.publisherIEEEen_US
dc.titleFully Integrated Electrothermal Multi-Domain Modeling of RF MEMS Switchesen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelMechanical Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Mechanical Engineeringen_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/87264/4/Saitou33.pdf
dc.identifier.doi10.1109/LMWC.2003.817121en_US
dc.identifier.sourceIEEE Microwave and Wireless Components Lettersen_US
dc.owningcollnameMechanical Engineering, Department of


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