Skin Effect Aggregated Heating in RF MEMS Suspended Structures
dc.contributor.author | Chow, Linda L. W. | en_US |
dc.contributor.author | Wang, Zhongde | en_US |
dc.contributor.author | Jensen, Brian D. | en_US |
dc.contributor.author | Saitou, Kazuhiro | en_US |
dc.contributor.author | Volakis, John Leonidas | en_US |
dc.contributor.author | Kurabayashi, Katsuo | en_US |
dc.date.accessioned | 2011-11-14T16:31:26Z | |
dc.date.available | 2011-11-14T16:31:26Z | |
dc.date.issued | 2005-06-12 | en_US |
dc.identifier.citation | Chow, L. L.-W.; Wang, Z.; Jensen, B. D.; Saitou, K.; Volakis, J. L.; Kurabayashi, K. (2005). Skin Effect Aggregated Heating in RF MEMS Suspended Structures." Proceedings of the IEEE MTT-S International Microwave Symposium: <http://hdl.handle.net/2027.42/87275> | en_US |
dc.identifier.issn | 01490-645X | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/87275 | |
dc.description.abstract | This paper presents experimental data together with 2 modeling approaches to demonstrate the increased heating of MEMS suspended structures at radio frequencies due to skin effects. Distinguishable average temperature rises are measured at 2, 13.5, and 18 GHz in a 616 _m _ 20 _m _ 2.7 _m suspended coplanar waveguide using 4-wire measurement configuration. Our measurements compare well with: (1) previous electromagnetic simulations and (2) a newly introduced analytical thermal model incorporating only skin effects. Buckling and plastic yielding have been observed during and after measurement. This study provides a simple and quantitative approach for the design of suspended structures such as low loss transmission lines, filters and switches with high power handling capability. | en_US |
dc.publisher | IEEE | en_US |
dc.title | Skin Effect Aggregated Heating in RF MEMS Suspended Structures | en_US |
dc.type | Article | en_US |
dc.subject.hlbsecondlevel | Mechanical Engineering | en_US |
dc.subject.hlbtoplevel | Engineering | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | Department of Mechanical Engineering | en_US |
dc.contributor.affiliationum | Department of Electrical Engineering and Computer Science | en_US |
dc.contributor.affiliationother | Dept. of Mechanical Engineering, Brigham Young University, Provo, UT 84602, USA. Dept. of Electrical and Computer Engineering, Ohio State University, Columbus, OH 43210, USA. | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/87275/4/Saitou79.pdf | |
dc.identifier.doi | 10.1109/MWSYM.2005.1517173 | en_US |
dc.identifier.source | Proceedings of the IEEE MTT-S International Microwave Symposium | en_US |
dc.owningcollname | Mechanical Engineering, Department of |
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