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Skin Effect Aggregated Heating in RF MEMS Suspended Structures

dc.contributor.authorChow, Linda L. W.en_US
dc.contributor.authorWang, Zhongdeen_US
dc.contributor.authorJensen, Brian D.en_US
dc.contributor.authorSaitou, Kazuhiroen_US
dc.contributor.authorVolakis, John Leonidasen_US
dc.contributor.authorKurabayashi, Katsuoen_US
dc.date.accessioned2011-11-14T16:31:26Z
dc.date.available2011-11-14T16:31:26Z
dc.date.issued2005-06-12en_US
dc.identifier.citationChow, L. L.-W.; Wang, Z.; Jensen, B. D.; Saitou, K.; Volakis, J. L.; Kurabayashi, K. (2005). Skin Effect Aggregated Heating in RF MEMS Suspended Structures." Proceedings of the IEEE MTT-S International Microwave Symposium: <http://hdl.handle.net/2027.42/87275>en_US
dc.identifier.issn01490-645Xen_US
dc.identifier.urihttps://hdl.handle.net/2027.42/87275
dc.description.abstractThis paper presents experimental data together with 2 modeling approaches to demonstrate the increased heating of MEMS suspended structures at radio frequencies due to skin effects. Distinguishable average temperature rises are measured at 2, 13.5, and 18 GHz in a 616 _m _ 20 _m _ 2.7 _m suspended coplanar waveguide using 4-wire measurement configuration. Our measurements compare well with: (1) previous electromagnetic simulations and (2) a newly introduced analytical thermal model incorporating only skin effects. Buckling and plastic yielding have been observed during and after measurement. This study provides a simple and quantitative approach for the design of suspended structures such as low loss transmission lines, filters and switches with high power handling capability.en_US
dc.publisherIEEEen_US
dc.titleSkin Effect Aggregated Heating in RF MEMS Suspended Structuresen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelMechanical Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Mechanical Engineeringen_US
dc.contributor.affiliationumDepartment of Electrical Engineering and Computer Scienceen_US
dc.contributor.affiliationotherDept. of Mechanical Engineering, Brigham Young University, Provo, UT 84602, USA. Dept. of Electrical and Computer Engineering, Ohio State University, Columbus, OH 43210, USA.en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/87275/4/Saitou79.pdf
dc.identifier.doi10.1109/MWSYM.2005.1517173en_US
dc.identifier.sourceProceedings of the IEEE MTT-S International Microwave Symposiumen_US
dc.owningcollnameMechanical Engineering, Department of


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