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Transition from multiple to single microcontact conduction during hot switching of microelectromechanical switches with ball-shaped dimples
dc.contributor.authorChow, Linda L. W.en_US
dc.contributor.authorSchrader, Steven A.en_US
dc.contributor.authorKurabayashi, Katsuoen_US
dc.date.accessioned2011-11-15T16:08:50Z
dc.date.available2011-11-15T16:08:50Z
dc.date.issued2006-09-25en_US
dc.identifier.citationChow, Linda L. W.; Schrader, Steven A.; Kurabayashi, Katsuo (2006). "Transition from multiple to single microcontact conduction during hot switching of microelectromechanical switches with ball-shaped dimples." Applied Physics Letters 89(13): 133501-133501-3. <http://hdl.handle.net/2027.42/87795>en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/87795
dc.description.abstractPrevious studies of electron transport within direct contact microelectromechanical switches have found that conduction occurs via nanoscale contact asperities. It has been claimed that reduced contact resistance can be achieved by using multiple contact switches; however, the ability of these switches to enhance power handling or lifetime remains a question. To study the contact mechanism, single-input-multiple-output switches with ball-shaped dimples were specially designed and tested. At all voltage levels of hot-switching operation, uneven current sharing among the outputs was observed. Furthermore, at softening voltage, an irreversible multiple to single conduction transition occurs and is found to alternate among different outputs.en_US
dc.publisherThe American Institute of Physicsen_US
dc.rights© The American Institute of Physicsen_US
dc.titleTransition from multiple to single microcontact conduction during hot switching of microelectromechanical switches with ball-shaped dimplesen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Mechanical Engineering, University of Michigan, Ann Arbor, Michigan 48109en_US
dc.contributor.affiliationumDepartment of Mechanical Engineering, University of Michigan, Ann Arbor, Michigan 48109 and Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan 48109en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/87795/2/133501_1.pdf
dc.identifier.doi10.1063/1.2352041en_US
dc.identifier.sourceApplied Physics Lettersen_US
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dc.owningcollnamePhysics, Department of


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